{"product_id":"global-semiconductor-pkg-mtls-outlook-to-2028","title":"Global Semiconductor Packaging Materials Outlook - 2024 Edition","description":"\u003cp\u003e\u003cspan style=\"background-color:rgb(255,255,255);color:#262626;\"\u003e\u003cfont face=\"arial\"\u003e\u003cspan style=\"font-size:13px;\"\u003eJoint report from SEMI and TechSearch International examining the global semiconductor packaging materials market size and 5-year forecast to 2028.\u003c\/span\u003e\u003c\/font\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"background-color:rgb(255,255,255);color:#262626;\"\u003e\u003cfont face=\"arial\"\u003e\u003cspan style=\"font-size:13px;\"\u003ePackaging material segments include substrates, leadframes, bonding wires, underfill materials, die attach materials, solder balls, wafer level packages, and plating chemicals.\u003c\/span\u003e\u003c\/font\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"background-color:rgb(255,255,255);color:#262626;\"\u003e\u003cfont face=\"arial\"\u003e\u003cspan style=\"font-size:13px;\"\u003eMarket size is broken out by region and is represented in units and revenue.\u003c\/span\u003e\u003c\/font\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106904932419,"sku":"215","price":1565800.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/Packaging_MaterialsOutlook_170x170text_2x_1.png?v=1776702912","url":"https:\/\/store-dev2.semi.org\/ja-jp\/products\/global-semiconductor-pkg-mtls-outlook-to-2028","provider":"SEMI Dev 2","version":"1.0","type":"link"}