{"title":"SEMI eラーニングコース","description":"","products":[{"product_id":"semi109-next-generation-of-printed-electronics","title":"SEMI109 次世代プリンテッドエレクトロニクス","description":"プリンテッド・フレキシブル・ハイブリッド・エレクトロニクス (PFHE) およびエネルギー・デバイスの分野は、超軽量、薄型、フレキシブル、大面積のエレクトロニクス、センサー、処理、I\/O、フォトニクス、およびパワーの新製品とフォームファクターへの道を提供します。実際、フレキシブル エレクトロニクスは静かにパッケージを変革し、エレクトロニクスの内部から外への根本的な変化を可能にしています。\u003cbr\u003e\u003cbr\u003eこのフレキシブル エレクトロニクス エキスパート クラス (2022 年 6 月 22 日に録画) では、ディスペンスやインクジェット印刷からロールツーロール印刷やコーティングに至るまで、加工技術の基礎と次世代の改良点を学びます。インストラクターは、最新の資料や追加の熱処理のニーズに関する最新情報についても説明しました。\u003cbr\u003e\u003cbr\u003eこのコースは、この分野の初心者だけでなく、最新の材料や装置の進歩に関する情報を迅速に得たいと考えている人にも適しています。\u003cbr\u003e \u003cbr\u003eプリンテッド、フレキシブル、ハイブリッド エレクトロニクス (PFHE) は、IoT、医療センシング、スマート パッケージングとラベル、構造モニタリング、人間の健康とパフォーマンス、モニター、極限環境、およびディスプレイ アプリケーションにおける新たなアプリケーションを可能にします。同時に、PFHE アプローチは、より迅速な製品開発、プロトタイピング、および単一のカスタム品目から大面積への製造サイクル、付加的な低コストの大量生産スケール、およびエレクトロニクスが私たちの社会でさらに普及するにつれて、より持続可能な経路を提供することもできます。世界。\u003cbr\u003e\u003cbr\u003eこのクラスでは、ディスペンスやインクジェット印刷からロールツーロール印刷やコーティングに至るまで、PFHE プロセス技術の基本と、これらのプロセスを可能にする材料および追加の熱プロセスについて説明します。\u003cbr\u003e \u003cbr\u003eまた、新しいフォームファクターと製造アプローチを提供し、従来のプロセスによるエレクトロニクスの性能を超える可能性のある高解像度 PFHE および積層造形のための次世代技術も研究されています。これらの技術は、エレクトロニクスから光学、量子材料に至るまでの分野で満たされていない異種集積の可能性にも影響を与えます。\u003cbr\u003e\u003cbr\u003e PFHE および印刷されたエネルギー材料トピックの例:\u003cul\u003e\n\n\u003cli\u003e電子材料およびエネルギー材料の塗布および 3D プリント\u003c\/li\u003e\n\n\u003cli\u003eエアゾール印刷\u003c\/li\u003e\n\n\u003cli\u003e高解像度のインクジェット印刷とコーティング\u003c\/li\u003e\n\n\u003cli\u003eスクリーン印刷\u003c\/li\u003e\n\n\u003cli\u003eフレキソ印刷\u003c\/li\u003e\n\n\u003cli\u003eグラビア印刷\u003c\/li\u003e\n\n\u003cli\u003eスロットダイコーティング\u003c\/li\u003e\n\n\u003cli\u003e対流、IR、光子熱処理\u003c\/li\u003e\n\n\u003cli\u003eマイクロコンタクト印刷とエンボス加工\u003c\/li\u003e\n\n\u003cli\u003eサブミクロンの電気流体力学印刷\u003c\/li\u003e\n\n\n\u003c\/ul\u003e講師について\u003cbr\u003e\u003cbr\u003eデビン・マッケンジー\u003cbr\u003e \u003cbr\u003eJ. デビン マッケンジーは、ワシントン研究財団のクリーン エネルギー教授であり、カリフォルニア大学の材料科学工学および機械工学の准教授です。マッケンジー博士は、世界クラスのプリンテッド エレクトロニクス、フレキシブル エレクトロニクス、エネルギー デバイスの製造およびテスト機能を備えたオープン アクセス研究所であるワシントン クリーン エネルギー テストベッドの所長でもあります。\u003cbr\u003e\u003cbr\u003eマッケンジー博士は、プリント フレキシブル バッテリーを商品化する Imprint Energy の共同創設者兼 CEO として、また 2016 年に買収されたプリント フレキシブル OLED ディスプレイ会社である Add-Vision の CTO として、新規製造分野のスタートアップを共同設立または主導してきた 20 年の経験があります。 2011 年に MIT スピンアウトした Kovio の副社長として、プリント Si RF デバイスの統合をリードしました。デビンはまた、英国に世界初のプリンテッド エレクトロニクス会社である Plastic Logic Ltd. を共同設立しました。マッケンジー博士は以前、AT\u0026amp;T ベル研究所の研究者でした。\u003cbr\u003e \u003cbr\u003eスタートアップの世界に参入する前、デビンはケンブリッジ大学で物理学の博士研究員を務め、フロリダ大学とマサチューセッツ工科大学で博士号、修士号、理学士号を取得しました。マッケンジー博士は 220 を超える特許と出版物を所有しており、10,000 回以上引用されています。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234398679107,"sku":"15939","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI109a_1e81dfa7-55fb-4a26-a8cf-9fd7f937b099.jpg?v=1776701324"},{"product_id":"semi102-artificial-intelligence-for-thin-film-manufacturing","title":"SEMI102 薄膜製造のための人工知能","description":"このコースでは、研究、開発、生産に対する機械学習と AI ベースのアプローチがどのようにクリーンルーム プロセスにメリットをもたらすかについて説明します。時間とともに変化する機器のパフォーマンスを AI ベースで特定し、現在必要なメソッドの結果に使用された以前のレシピの影響は、AI を使用してプロセスの変動性を低減する方法のほんの一部にすぎません。\u003cbr\u003e\u003cbr\u003eこのコースはもともと 2020 年 8 月に記録されましたが、現在は e ラーニング形式で提供されています。\u003cbr\u003e\u003cbr\u003e SEMIスタンダードPVおよびPVマテリアル中国合同TC支部2020年春季会合 \u003cbr\u003eこのコースでは、研究、開発、生産に対する機械学習と AI ベースのアプローチがどのようにクリーンルーム プロセスにメリットをもたらすかについて説明します。時間とともに変化する機器のパフォーマンスを AI ベースで特定し、現在必要なメソッドの結果に使用された以前のレシピの影響は、AI を使用してプロセスの変動性を低減する方法のほんの一部にすぎません。\u003cbr\u003e\u003cbr\u003eコーネル大学のチームは、AI アプローチを適用して、移動するシャトルと接点の間のギャップを適切に制御する必要がある RF ウェイクアップ NEMS (Nano ElectroMechnical System) スイッチの開発に関わるリソグラフィーとエッチングのプロセスを最適化しました。リソグラフィーの結果を予測するためのデシジョン ツリー ベースの AI モデルについて報告します。\u003cbr\u003e \u003cbr\u003eこの研究は、特徴抽出とプロセス変数のモデリングに CD-SEM 画像を使用して、プラズマ エッチングとリソグラフィーと薄膜エッチングの組み合わせ予測に適用されています。プロセスモデリング CAD ツールをトレーニングしてプロセス開発エクスペリエンスを向上させるための追加のアプローチが開発されています。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234399072323,"sku":"15932","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI102a_9e6b34c3-6cc0-45cd-9d49-9d9824fbef47.jpg?v=1776701328"},{"product_id":"semi107-printing-curing-and-characterization-methods-for-printable-conductors","title":"SEMI107 印刷可能な導体の印刷、硬化、および特性評価方法","description":"この FHE マスター クラスでは、ポリマー基板上の回路の積層造形に印刷可能な導体を使用するための基本をすべてカバーします。参加者は、利用可能な導電性インクのさまざまな種類のクラスと、その性能とコストを特徴付ける方法について学びます。学生はまた、従来の印刷方法とデジタル印刷方法、乾燥\/硬化\/焼結方法、従来の「プリントされた」回路基板と比較した設計と組み立ての違いの概要を理解します。\u003cbr\u003e\u003cbr\u003eコース概要：\u003cul\u003e\n\n\u003cli\u003e導電性インクのクラスとフィラーの種類の歴史的展望と概要\u003c\/li\u003e\n\n\u003cli\u003e印刷導体とフィラーの種類の長所と短所\u003c\/li\u003e\n\n\u003cli\u003e導電性インクの性能基準を理解する\u003c\/li\u003e\n\n\u003cli\u003e抵抗測定、シート抵抗対体積抵抗率、単位換算、膜厚測定、表面粗さ測定\u003c\/li\u003e\n\n\u003cli\u003e低温印刷可能な導体の微細構造を理解する\u003cul\u003e\n\n\u003cli\u003eパーコレーション導体: 銀入りポリマー厚膜 (PTF) インクおよび等方性 ECA\u003c\/li\u003e\n\n \u003cli\u003e焼結可能導体: ナノ粒子、有機金属\/粒子ハイブリッド、銅インク\u003c\/li\u003e\n\n\u003cli\u003e半焼結導体\u003c\/li\u003e\n\n\n\u003c\/ul\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003e機械的および環境的信頼性の試験方法\u003c\/li\u003e\n\n\u003cli\u003e印刷方法の仕組みの概要\u003cul\u003e\n\n\u003cli\u003eマスターを使用する方法: スクリーン、フレキソ、グラビア、グラビアオフセット\u003c\/li\u003e\n\n\u003cli\u003e2D および 3D の「デジタル」または直接書き込み方法: ジェットベース、マイクロディスペンス、\u003c\/li\u003e\n\n\n\u003c\/ul\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003e従来の非平衡光子的、化学的、機械的硬化方法\u003c\/li\u003e\n\n\u003cli\u003e回路のAMに対する分解能とシート抵抗の限界を理解する\u003c\/li\u003e\n\n\u003cli\u003e特定のシート抵抗を達成するために適切な導体を選択するためのトレードオフの計算\u003c\/li\u003e\n\n\u003cli\u003e透明な印刷可能な導体およびフィルム\u003c\/li\u003e\n\n\n\u003c\/ul\u003e \u003cbr\u003eMike Mastropietro について: Mike Mastropietro は、20 年以上のキャリア全体を、配合、従来型印刷、直接書き込み印刷、平衡および非平衡硬化方法、アプリケーション開発など、FHE デバイス用の印刷可能な電子機能材料および積層造形方法に取り組んできました。 ACI に入社する前は、NextFlex で 2 年間印刷\/直接書き込みプログラムを管理し、材料の選択とデバイスへの統合を監督していました。\u003cbr\u003e\u003cbr\u003e 27 歳のとき、彼はナノ粒子インク会社である PChem Associates を共同設立しました。その独自の低温焼結インク技術は 10 年後に NovaCentrix によって買収されました。彼はハイブリッド粒子 - 有機金属分解 (MOD) ベースのインクのパイオニアである Parelec Inc. でキャリアをスタートしました。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234399498307,"sku":"15937","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI107a.jpg?v=1776701330"},{"product_id":"semi101-flexible-power-sources-challenges-progress-and-integration","title":"SEMI101 フレキシブル電源: 課題、進歩、統合","description":"SEMI FlexTechは、フレキシブル・エレクトロニクスおよびプリンテッド・エレクトロニクスの使用において最も困難であることが証明されているトピックに関する一連のフレキシブル・エレクトロニクス・マスター・クラスを提供しています。このシリーズにより、製品設計者、インテグレータ、その他この分野に不慣れな人がテクノロジーやコンポーネントを評価し、製品に最適な選択を行うことができます。\u003cbr\u003e\u003cbr\u003eシリーズの最初のコースは、柔軟な電源: 課題、進歩、統合です。このコースは、2020 年 7 月 29 日にライブの視聴者向けに提供され、現在はオンデマンドで視聴できるようになりました。\u003cbr\u003e \u003cbr\u003eマスタークラスの要約: 高性能マイクロエレクトロニクスを紙のように薄くフレキシブルなハイブリッドエレクトロニクス (FHE) に統合できる新しい材料とプロセスが登場するにつれ、超薄型化の目標もサポートする新しい電源の需要が高まっています。そして柔軟です。\u003cbr\u003e\u003cbr\u003e重要な課題の 1 つは、電池の厚さが減少し、パッケージングが全体積に占める割合が増加するにつれて、高いエネルギー密度を達成できるかどうかです。この課題は、高電力 (周期的な大電流バースト) と高エネルギー (場合によっては長年にわたる動作) の両方を必要とする多くの FHE システムのデューティ サイクルが厳しいため、さらに複雑になります。\u003cbr\u003e\u003cbr\u003e同時に、新しい電源は、安全性、耐久性、幅広い保管温度および動作温度との互換性、および FHE プラットフォームへの効果的な統合をサポートするニーズに関する一般的な高い基準を満たしている必要があります。\u003cbr\u003e \u003cbr\u003eこのウェビナーでは、FHE コミュニティのニーズを満たすために登場した新しい電源の課題と進歩についてレビューします。\u003cbr\u003e\u003cbr\u003eブライアン・バーランド\u003cbr\u003eITNエネルギーシステム社最高技術責任者","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234399563843,"sku":"15931","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI101a_a465b226-abdf-42a5-b2ee-c2acb3566985.jpg?v=1776701325"},{"product_id":"semi104-flexible-batteries","title":"SEMI104 フレキシブルバッテリー","description":"このマスタークラスでは、バッテリーの用語、化学、フレキシブルエレクトロニクスに関連する構造の基本を取り上げます。フレキシブル バッテリーの実用化と製造に関連する特有の課題について説明するとともに、現在の最先端技術と新たなフレキシブル バッテリー技術の概要についても説明します。プレゼンテーションは 90 分で、2021 年 4 月 20 日のライブ録画に参加した参加者からの 30 分の質疑応答とディスカッションが含まれます。コースの内容は次のとおりです。\u003cul\u003e\n\n\u003cli\u003e柔軟なパワー\u003cul\u003e\n\n\u003cli\u003eフレキシブルバッテリー\u003c\/li\u003e\n\n\u003cli\u003e印刷されたバッテリー\u003c\/li\u003e\n\n\u003cli\u003e薄型バッテリー\u003c\/li\u003e\n\n\n\u003c\/ul\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003e柔軟なバッテリーと持続可能性\u003c\/li\u003e\n\n\u003cli\u003e柔軟なバッテリーの化学的性質\u003cul\u003e\n\n\u003cli\u003e無毒なフレキシブルバッテリー\u003c\/li\u003e\n\n \u003cli\u003eフレキシブル電池用材料\u003c\/li\u003e\n\n\u003cli\u003eフレキシブルバッテリー用固体電解質\u003c\/li\u003e\n\n\n\u003c\/ul\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003e車体搭載電子機器用のバッテリー\u003c\/li\u003e\n\n\u003cli\u003e柔軟なバッテリーテスト\u003c\/li\u003e\n\n\u003cli\u003e柔軟なバッテリーの安全性\u003c\/li\u003e\n\n\u003cli\u003eフレキシブルなバッテリー仕様\u003c\/li\u003e\n\n\u003cli\u003e柔軟なバッテリー電力密度\u003c\/li\u003e\n\n\u003cli\u003e柔軟なバッテリーエネルギー密度\u003c\/li\u003e\n\n\n\u003c\/ul\u003e\n\u003cbr\u003e講師について: J. Devin MacKenzie は、ワシントン研究財団のクリーン エネルギー教授であり、カリフォルニア大学の材料科学工学および機械工学の准教授です。マッケンジー博士は、世界クラスのプリンテッド エレクトロニクス、フレキシブル エレクトロニクス、エネルギー デバイスの製造およびテスト機能を備えたオープン アクセス研究所であるワシントン クリーン エネルギー テストベッドの所長でもあります。\u003cbr\u003e \u003cbr\u003eマッケンジー博士は、プリント フレキシブル バッテリーを商品化する Imprint Energy の共同創設者兼 CEO として、また 2016 年に買収されたプリント フレキシブル OLED ディスプレイ会社である Add-Vision の CTO として、新規製造分野のスタートアップを共同設立または主導してきた 20 年の経験があります。 2011 年に MIT スピンアウトした Kovio の副社長として、プリント Si RF デバイスの統合をリードしました。デビンはまた、英国に世界初のプリンテッド エレクトロニクス会社である Plastic Logic Ltd. を共同設立しました。マッケンジー博士は以前、AT\u0026amp;T ベル研究所の研究者でした。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234400448579,"sku":"15934","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI104a.jpg?v=1776701331"},{"product_id":"semi106-flexible-hybrid-electronics-2-0-based-on-fan-out-wafer-packaging","title":"SEMI106 ファンアウト・ウェーハ・パッケージングに基づくフレキシブル・ハイブリッド・エレクトロニクス 2.0","description":"チップレットやダイレットなどの新しいパッケージング パラダイムがフレキシブル ハイブリッド エレクトロニクス (FHE) の世界に影響を与える理由とその影響を、業界の第一人者である UCLA の Subramanian Iyer 博士から学びましょう。このコースでは、これらのパッケージがどのようにしてこれほど強力な機能を備え、はるかに小さく柔軟な設置面積で高度なパフォーマンスを実現しているかを探ります。\u003cbr\u003e \u003cbr\u003e概要: ここ数年、エレクトロニクス パッケージングは​​ CMOS スケーリングの影から当然のように現れ、高性能およびモバイル アプライアンス コンピューティングに大きな影響を与えてきました。\u003cbr\u003e\u003cbr\u003eフレキシブル ハイブリッド エレクトロニクス (FHE) の分野も発展し、医療およびウェルネス エレクトロニクスの分野に大きな影響を与えています。これらのデバイスの第 1 世代は、ほとんどの部分で、より薄い PCB を使用し、薄型または薄型パッケージ化された「古い」世代のチップをこれらのプラットフォーム上に組み立てることによって、プリント基板 (PCB) テクノロジを採用しています。通常は、接続するための粗いプリント配線が使用されます。そのようなチップは少数です。\u003cbr\u003e \u003cbr\u003eこのアプローチは、この分野を前進させるのに非常に役立ちますが、このトレンドを次のレベルに進めるためには、シリコンと高度なパッケージング技術の両方のトレンドに適応して取り入れる必要があります。今後の主なパラダイム課題は次のとおりです。FHE のスケーリング全般 – これには、エッジ AI、より高性能な相互接続、柔軟な高密度エネルギー ストレージ、無線通信、高度な人間工学などを含む、より高度な CMOS ノードでのダイレット (チップレット) テクノロジーの採用が含まれます。より低コストでより高い信頼性を実現します。\u003cbr\u003e\u003cbr\u003eこの講演では課題に対処し、今後数年間でこれらの目標を達成するために考えられる技術ロードマップの概要を説明します。\u003cbr\u003e \u003cbr\u003eアイヤー教授について: サブラマニアン S. アイヤー (Subu) は、カリフォルニア大学ロサンゼルス校の特別教授です。彼は異種混合統合およびパフォーマンス スケーリング センター (CHIPS) のディレクターです。それ以前は、IBM フェローでした。彼の主な技術的貢献は、世界初の SiGe ベース HBT、サリサイド、電気ヒューズ、組み込み DRAM、および第 1 世代の真の低消費電力ポータブル デバイスの製造に使用される 45nm テクノロジー ノードの開発と、初の商用インターポーザーおよび 3D 統合製品です。 。彼は、ウェーハスケールのアーキテクチャ、インメモリアナログコンピューティング、医療工学アプリケーションを可能にする可能性のある新しいパッケージングパラダイムとデバイス革新を模​​索してきました。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234400809027,"sku":"15936","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI106a.jpg?v=1776701330"},{"product_id":"semi103-hybrid-integration-techniques-for-flexible-electronics","title":"SEMI103 フレキシブルエレクトロニクスのためのハイブリッド統合技術","description":"1 時間のクラスでは、フレキシブル ハイブリッド エレクトロニクスの製造のために PARC で実践されている技術について説明します。トピックには、相互接続、論理回路と抵抗器の印刷、集積回路の接着、さまざまなタイプのセンサーの統合などが含まれます。この技術は、フレキシブル基板上のワイヤレス センサーのプロトタイプや繊維上のエレクトロニクスの開発のさまざまな例で説明されています。\u003cbr\u003e\u003cbr\u003eこのセッションで取り上げられる具体的なトピックは次のとおりです。\u003cul\u003e\n\n\u003cli\u003e印刷相互接続\u003c\/li\u003e\n\n\u003cli\u003e100um未満で細い線、パッド、パッドピッチを印刷\u003c\/li\u003e\n\n\u003cli\u003e論理回路と抵抗器\u003c\/li\u003e\n\n\u003cli\u003e集積回路の接着\u003c\/li\u003e\n\n\u003cli\u003eパフォーマンスを大幅に低下させることなく、さまざまなタイプのセンサーをフレキシブル基板上に統合\u003c\/li\u003e\n\n\u003cli\u003eミクロンレベルの精度でピックアンドプレイスを行う\u003c\/li\u003e\n\n\n\u003c\/ul\u003eパロアルト研究センターのロバート・ストリートによるコース指導","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234402381891,"sku":"15933","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI103a.jpg?v=1776701326"},{"product_id":"semi105-ai-enhanced-microfabrication-of-printed-electronics","title":"SEMI105 AIを活用したプリンテッドエレクトロニクスの微細加工","description":"概要\u003cbr\u003e\u003cbr\u003eクリーンルームや新しいプリンテッド エレクトロニクス ツールでの製造は、多くの場合、装置、環境、材料の時間とともに変化するパラメーターの関数です。多くの場合、パラメーターには、さまざまなプロセス ステップやツール セット間で相互依存関係があります。従来は物理ベースのモデルと線形回帰が使用されてきましたが、これらでは多くの場合、根底にある変動を学習するには十分ではありません。\u003cbr\u003e \u003cbr\u003eこのコースでは、クリーンルームとプリンテッド エレクトロニクスの科学技術を、人工知能と機械学習によって実現される高度なデータ処理能力に結び付けるために必要な内容を学びます。クリーンルーム ツールは本質的に何百万もの内部変数を持つことができ、データセットから学習することができ、従来のフィードバック制御やプロセス安定化アプローチに対する強力かつ補完的なアプローチを提供します。\u003cbr\u003e\u003cbr\u003e学習モデルは、画像 (CD-SEMS、光学画像)、時刻歴データ (発光分光法)、およびテキストのプロセス情報に基づいて開発されます。クラスのサブセットには、(1) 画像データを前処理して学習ベースのモデルを作成するアプローチ、(2) モデルの検証、(3) ナノメカニカル スイッチ製造への応用、および (4) クラウド ベースの実装、データ セキュリティ、およびデータの標準化。\u003cbr\u003e\u003cbr\u003eコース概要：\u003col\u003e\n\n\u003cli\u003eはじめに – 微細加工およびプリンテッドエレクトロニクスにおける AI の必要性\u003col\u003e\n\n\u003cli\u003e微細加工: ツールの変動、プロセスの変動\u003c\/li\u003e\n\n \u003cli\u003eプリンテッド エレクトロニクス: インクジェットのバリエーション、空間バリエーション\u003c\/li\u003e\n\n\n\u003c\/ol\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003e製作とデータ収集\u003col\u003e\n\n\u003cli\u003e計測学\u003c\/li\u003e\n\n\u003cli\u003e製造装置データ\u003c\/li\u003e\n\n\u003cli\u003eクリーンルームデータ\u003c\/li\u003e\n\n\n\u003c\/ol\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003eデータと画像処理\u003col\u003e\n\n\u003cli\u003eデータの種類\u003c\/li\u003e\n\n\u003cli\u003e時間依存データ\u003c\/li\u003e\n\n\u003cli\u003e空間的に変化するデータ\u003c\/li\u003e\n\n\u003cli\u003eデータのサイズ\u003c\/li\u003e\n\n\u003cli\u003e計算能力\u003c\/li\u003e\n\n\n\u003c\/ol\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003eAIと機械学習のアルゴリズム\u003col\u003e\n\n\u003cli\u003e回帰\u003c\/li\u003e\n\n\u003cli\u003e二分木\u003c\/li\u003e\n\n\u003cli\u003eランダムフォレスト\u003c\/li\u003e\n\n\u003cli\u003eディープ ニューラル ネット (例: Pix2Pix を使用した画像から画像への変換)\u003c\/li\u003e\n\n\n\u003c\/ol\u003e\n\n\n\u003c\/li\u003e\n\n\u003cli\u003e実績と見通し\u003col\u003e\n\n\u003cli\u003e線幅の改善\u003c\/li\u003e\n\n\u003cli\u003eクラウドベースの実装\u003c\/li\u003e\n\n\n\u003c\/ol\u003e\n\n\n\u003c\/li\u003e\n\n\n\u003c\/ol\u003e講師について\u003cbr\u003e\u003cbr\u003eアミット・ラル \u003cbr\u003eアミット・ラルは、ニューヨーク州イサカにあるコーネル大学電気・コンピュータ工学部のロバート M. シャーフ 1977 年教授です。彼の研究は、マイクロ\/ナノ電気機械システム、物理音響および超音波、慣性センサー、生物医学 MEMS、アナログ回路設計、ソリッドステートエレクトロニクス、自律マイクロシステム用の放射性薄膜、およびナノファブリケーションにおける新しい製造アプローチとアーキテクチャをもたらしました。彼の研究の現在の焦点は、(1) チップスケールの通信、センシング、および計算のためのギガヘルツ超音波、(2) 長寿命 IoT のためのほぼゼロパワーセンサー、(3) 表面弾性波に基づく超音波慣性センサーです。\u003cbr\u003e\u003cbr\u003eピーター・C・ドーシュク \u003cbr\u003ePeter C. Doerschuk は、ニューヨーク州イサカにあるコーネル大学の電気およびコンピュータ工学部およびマイニッヒ生物医工学部の教授です。信号と画像の理解に対する彼の関心は、微細加工から生体粒子の単粒子クライオ電子顕微鏡法まで、さまざまな問題に対する新しいアルゴリズムを生み出しました。\u003cbr\u003e\u003cbr\u003eベンヤミン・ダヴァジ \u003cbr\u003eBenyamin Davaji は、コーネル大学電気コンピュータ工学部の博士研究員です。 Ben は、SonicMEMS 研究所の Amit Lal 教授と協力して、ソリッドステート音響波慣性センサー、超音波神経変調マイクロデバイス、イベント駆動センサー、および機械学習と人工知能を使用してマイクロおよびナノシステムの設計と製造を強化する方法の開発に取り組んでいます。彼は、優れたメンタリングに対して 2019 年コーネル功績賞を受賞し、2016 年にはヒルトン ヘッド カンファレンスで MEMS シャーク パブ タンク賞を受賞しました。コーネル大学に入社する前、ベンはマーケット大学のナノデバイス研究所で、チュンフン・リー教授とマイクロサーマル分析および熱マイクロ流体システムについて研究し、博士号を取得しました。電気工学の分野で。博士課程在学中に、2014 年 IEEE ラリー ハウス賞と 2014 年工学部優秀 TA 賞を受賞しました。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234403037251,"sku":"15935","price":49.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI105a.jpg?v=1776701327"},{"product_id":"semi108-fhe-for-medical-industrial-applications","title":"医療および産業用途向けのSEMI108 FHE","description":"FlexTech マスター クラス シリーズの 9 回目となるこのコースでは、フレキシブル エレクトロニクスを医療機器や工業製品に最適化するための最もよく知られた方法を深く掘り下げます。当社の専門家が、フレキシブルで印刷可能な部品や回路をシステムまたはサブシステムに設計する際の最も重要な考慮事項と、考慮すべき多くのアプローチについて説明します。\u003cbr\u003e\u003cbr\u003eこのコースは、エレクトロニクス設計の初心者だけでなく、電子設計には慣れているが最新の材料や技術について復習したいと考えている人にも適しています。\u003cbr\u003e\u003cbr\u003eコース概要\u003cul\u003e\n\n\u003cli\u003eフレキシブルハイブリッドエレクトロニクス: 定義、設計、製造\u003c\/li\u003e\n\n\u003cli\u003eハード電子部品とソフト電子部品の接続に関する課題\u003c\/li\u003e\n\n\u003cli\u003eIEEE 異種統合ロードマップ (HIR) の概要\u003c\/li\u003e\n\n\u003cli\u003eインクと封止材の概要\u003c\/li\u003e\n\n\u003cli\u003e印刷方法：ディスペンス、インクジェット、スクリーン印刷、多軸エアロゾルジェット印刷\u003c\/li\u003e\n\n\u003cli\u003eプリント配線の電気機械的評価\u003c\/li\u003e\n\n\u003cli\u003e抵抗器とコンデンサーの積層造形\u003c\/li\u003e\n\n\u003cli\u003e伸縮性の高い導体\u003c\/li\u003e\n\n\u003cli\u003eZ方向の相互接続 - プリントビア\u003c\/li\u003e\n\n \u003cli\u003eプリントされた RF デバイスとアンテナ\u003c\/li\u003e\n\n\u003cli\u003eデバイスとコンポーネントの配置と組み立て\u003c\/li\u003e\n\n\u003cli\u003e半導体デバイスの薄型化\u003c\/li\u003e\n\n\u003cli\u003eデバイスとコンポーネントをフレキシブル基板に接着するアプローチ\u003c\/li\u003e\n\n\u003cli\u003e運用の概念と性能・信頼性の評価\u003c\/li\u003e\n\n\u003cli\u003e医療用および産業用センサーへのアプリケーションが全体に組み込まれます。\u003c\/li\u003e\n\n\n\u003c\/ul\u003e\n\u003cbr\u003e講師: マーク D. ポリクス博士ニューヨーク州立大学ビンガムトン校のニューヨーク大学工学部特別教授、システム科学、産業工学、材料科学工学のエンパイア・イノベーション教授。彼は、ニューヨーク州の先進技術センターであり、NextFlex のニューヨーク ノードの本拠地である先進マイクロエレクトロニクス製造センター (CAMM) の所長です。彼は、ビンガムトン キャンパスのスマート エネルギー学際的卓越領域の議長を務めています。\u003cbr\u003e \u003cbr\u003e彼の研究は、高性能エレクトロニクス パッケージング、フレキシブル ハイブリッド エレクトロニクス、医療および産業用センサー、プリント RF コンポーネント、材料、加工、エアロゾル ジェット プリンティング、ロールツーロール製造、インライン品質管理などの業界関連トピックの分野です。そして電子機器の信頼性。彼はニューヨーク州立大学学長賞研究優秀賞を受賞しています。","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234403135555,"sku":"15938","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI108a.jpg?v=1776701332"},{"product_id":"introduction-to-the-world-of-semiconductors","title":"Introduction to the World of Semiconductors","description":"\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Description: \u003c\/strong\u003eBy purchasing The Semiconductor Industry at a Glance course, you will get \u003cstrong\u003e\u003cu\u003ethree free courses.  \u003c\/u\u003e\u003c\/strong\u003eThey are Intro to Semiconductor, Engineering Design Process and Microchips \u0026amp; Solar Chips. This three-course bundle provides new industry professionals and younger learners with the foundational knowledge that they need to be successful in their semiconductor careers. It’s an exploratory course series that invites you to take a quick look at the industry and its ecosystem, consider potential career paths, and understand the basics of semiconductors.  The courses are listed below along with their associated learning objectives.   \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Objectives: \u003c\/strong\u003e  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eThe Semiconductor Industry at a Glance\u003c\/strong\u003e  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eList the segments that make up the electronics and semiconductor industry.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eExplain how innovation has impacted electronics technologies.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eList SEMI’s Tech Communities that support industry members.   \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eDefine the value that the electronics industry has on national and global markets. \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003e Introduction to Semiconductor\u003c\/strong\u003e\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eDefine conductor, insulator, and semiconductor.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eDefine Doping.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eList the two types of semiconductor materials formed with doping.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eName the current carriers in N and P-type material.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eExplain how current flows in semiconductor material.  \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003e Engineering Design Process\u003c\/strong\u003e\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eExplain the meaning of the engineering design process.\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eList a series of steps in the engineering design process.\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eDescribe each step of the engineering design process.\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eMicrochips and Solar Chips\u003c\/strong\u003e\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eExplain what microchips and solar chips are.\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eList the series of steps in the microchip-making process.\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eDescribe each step of the microchip-making process. \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Duration: \u003c\/strong\u003e\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e90 minutes\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eTarget Audience: \u003c\/strong\u003e \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eThe target audient includes undergraduate and graduate students, doctoral candidates, and professional with a basic understanding of science, computer operations, and semiconductor technology. It also encompasses individuals who are new to the field or contemplating entering it.\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e \u003c\/span\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eRequisite Knowledge: \u003c\/strong\u003e \u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#1F2124;\"\u003e\u003ci\u003e\u003cspan style='font-family:\"Segoe UI\",sans-serif;font-size:10.5pt;'\u003eNone\u003c\/span\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40788564443203,"sku":"17237","price":99.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/d20721f1-c753-45e8-b153-ad7f9fa0feab.jpg?v=1776701092"},{"product_id":"implementing-the-semi-e183-standard-rich-interactive-test-database-bundle","title":"Implementing the SEMI E183 Standard (Rich Interactive Test Database) Bundle","description":"\u003cdiv class=\"globo-formbuilder\" data-id=\"MTAxMjY5\"\u003e\u003c\/div\u003e\n\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eCourse Description\u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e      \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003eAre you a semiconductor industry professional who is looking to take advantage of Industry 4.0 to bring order to chaos of your test process? If so, these courses will provide you with sufficient information on the SEMI E183 Standard. By taking these courses, you’ll discover what you need to know about implementing Rich Interactive Test databases (RITdb) and Test Cell RITdb Clients. The first course will take you through the technicalities of the proof of concepts and the features in a client that supports the standard. The second course will teach you how to implement tester portals and clients based on the standard for sharing test floor data and events. Think of these courses as a guide to help you bring order to the chaos in your testing process. Improve your testing productivity.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003eTo supplement this course bundle, we highly recommend that you also purchase (if you have not already) the \u003c\/span\u003e\u003cspan style=\"font-size: 11pt;\"\u003e\u003ca href=\"https:\/\/store-us.semi.org\/products\/e18300-semi-e183-specification-for-rich-interactive-test-database-ritdb?_pos=1\u0026amp;_sid=0b740e939\u0026amp;_ss=r\"\u003e\u003cu\u003eSEMI E183 Standard\u003c\/u\u003e\u003c\/a\u003e\u003cu\u003e \u003c\/u\u003e\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003ethat is sold separately. It is important for you to have access to the standard as you engage with the second course of this series.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003eThis bundle includes two courses:\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cdiv class=\"globo-formbuilder\" data-id=\"MTAxMjU0\"\u003e\u003c\/div\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eIntroduction to Implementing a Test Cell RITdb Client.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eIntroduction to RITdb (SEMI E183) Implementation on a Test Floor.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-size: 11pt;\"\u003e\u003cem\u003e\u003cstrong\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eCourse Objectives\u003c\/span\u003e\u003c\/strong\u003e\u003c\/em\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eIdentify the key components of RITdb topology.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eExplain the various features of a tester portal.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eOrder high-level steps in the event model.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eRecognize the requirements satisfied by E183.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eExplain how to send an RITdb Event.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eExplain the Rich Interactive Test database (RITdb) SEMI Standard specification (E183).\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eIdentify the technical details of the proof of concepts.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003eDescribe the features in the client that meet the E183 standard.\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-size: 11pt;\"\u003e\u003cem\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/em\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003e3 hours or 90 minutes each\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-size: 11pt;\"\u003e\u003cem\u003e\u003cstrong\u003eTarget Audience\u003c\/strong\u003e\u003c\/em\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003eTest floor managers, supervisors, test and systems engineers, technicians, yield management professionals, test data analysts, and\/or any individual working directly with the SEMI E183 Standard\u003c\/span\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e \u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif; font-size: 11pt;\"\u003e\u003cstrong\u003e\u003cem\u003eRequisite Knowledge\u003c\/em\u003e\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"margin-left: 0; margin-right: 0; text-align: left;\"\u003e\u003cspan style=\"font-size: 14.67px;\"\u003e\u003cspan style=\"font-family: Calibri,Calibri_EmbeddedFont,Calibri_MSFontService,sans-serif;\"\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cem\u003eNone\u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cdiv class=\"globo-formbuilder\" data-id=\"OTk5MjE=\"\u003e\u003cbr\u003e\u003c\/div\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40788565852227,"sku":"","price":70.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/2048x2048E183Bundle3.png?v=1701969275"},{"product_id":"prototyping-techniques-cad-fabrication-and-microcontrollers","title":"Prototyping Techniques: CAD, Fabrication, and Microcontrollers","description":"\u003ch3\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN-US\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eDescription\u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"134245418\":false,\"134245529\":false,\"335559738\":280,\"335559739\":80}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/h3\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: rgb(255, 255, 255); clear: both; color: rgb(0, 0, 0); cursor: text; direction: ltr; font-family: Arial, Arial_MSFontService, sans-serif; font-size: 14.6667px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: 400; letter-spacing: normal; margin: 0px; orphans: 2; overflow: visible; padding: 0px; position: relative; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; white-space: normal; widows: 2; word-spacing: 0px;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 16px 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN-US\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eCovers the strategies, tools, and materials used to create effective engineering prototypes quickly and efficiently. Learners gain hands-on knowledge of the full rapid prototyping workflow-from the design concept and engineering drawings to the integration of electronics and the use of CNC machines, 3D printers, and traditional tools. \u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: rgb(255, 255, 255); clear: both; color: rgb(0, 0, 0); cursor: text; direction: ltr; font-family: Arial, Arial_MSFontService, sans-serif; font-size: 14.6667px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: 400; letter-spacing: normal; margin: 0px; orphans: 2; overflow: visible; padding: 0px; position: relative; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; white-space: normal; widows: 2; word-spacing: 0px;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 16px 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eEmphasis is placed on selecting the right materials and fabrication techniques based on the specific needs of a prototype, as well as using CAD tools and microcontrollers to extend prototype functionality. The approach is practical and project-based, giving learners the confidence to bring ideas to life across industries like robotics, product design, and manufacturing. \u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: rgb(255, 255, 255); clear: both; color: rgb(0, 0, 0); cursor: text; direction: ltr; font-family: Arial, Arial_MSFontService, sans-serif; font-size: 14.6667px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: 400; letter-spacing: normal; margin: 0px; orphans: 2; overflow: visible; padding: 0px; position: relative; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; white-space: normal; widows: 2; word-spacing: 0px;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 16px 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eUpon successful completion, learners will earn a certificate of completion from Arizona State University.\u003c\/span\u003e\u003cspan data-ccp-props='{\"335559738\":240,\"335559739\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: transparent; box-sizing: border-box; color: windowtext; font-family: 'Segoe UI', 'Segoe UI Web', Arial, Verdana, sans-serif; font-kerning: none; font-size: 12px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: normal; letter-spacing: normal; margin: 16px 0px; orphans: 2; overflow-wrap: break-word; padding: 0px; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; vertical-align: baseline; white-space: pre-wrap; widows: 2; word-spacing: 0px;\" class=\"Paragraph SCXW8768208 BCX8\"\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; box-sizing: border-box; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW8768208 BCX8 NormalTextRun\"\u003e\u003cstrong style=\"box-sizing: border-box; font-style: inherit; font-weight: revert;\"\u003eCurriculum Duration\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: transparent; box-sizing: border-box; color: windowtext; font-family: 'Segoe UI', 'Segoe UI Web', Arial, Verdana, sans-serif; font-kerning: none; font-size: 12px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: normal; letter-spacing: normal; margin: 16px 0px; orphans: 2; overflow-wrap: break-word; padding: 0px; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; vertical-align: baseline; white-space: pre-wrap; widows: 2; word-spacing: 0px;\" class=\"Paragraph SCXW8768208 BCX8\"\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; box-sizing: border-box; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW8768208 BCX8 NormalTextRun\"\u003e15 Hours\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: rgb(255, 255, 255); clear: both; color: rgb(0, 0, 0); cursor: text; direction: ltr; font-family: Arial, Arial_MSFontService, sans-serif; font-size: 14.6667px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: 400; letter-spacing: normal; margin: 0px; orphans: 2; overflow: visible; padding: 0px; position: relative; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; white-space: normal; widows: 2; word-spacing: 0px;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp aria-level=\"3\" role=\"heading\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: rgb(67, 67, 67); font-kerning: none; font-style: normal; font-weight: normal; margin: 18.6667px 0px 5.33333px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN-US\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eWhat you’ll learn\u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"134245418\":false,\"134245529\":false,\"335559738\":280,\"335559739\":80}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: rgb(255, 255, 255); color: rgb(0, 0, 0); font-family: Arial, Arial_MSFontService, sans-serif; font-size: 14.6667px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: 400; letter-spacing: normal; margin: 0px; orphans: 2; padding: 0px; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; white-space: normal; widows: 2; word-spacing: 0px;\" class=\"SCXW21825373 BCX8\"\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; clear: both; cursor: text; direction: ltr; margin: 0px; overflow: visible; padding: 0px; position: relative; user-select: text;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 16px 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eBy the end of this series, learners will be able to:\u003c\/span\u003e\u003cspan data-ccp-props='{\"335559738\":240,\"335559739\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eApply the engineering design process to identify problems and generate rapid solutions\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559738\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN-US\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eSelect appropriate materials and fabrication methods for prototyping tasks\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eSafely operate basic machining tools and digital manufacturing equipment\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eIncorporate electronics, sensors, and microcontrollers into working prototypes\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eUse CAD tools and technical drawings to support prototyping and documentation\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559739\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; clear: both; cursor: text; direction: ltr; margin: 0px; overflow: visible; padding: 0px; position: relative; user-select: text;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp aria-level=\"3\" role=\"heading\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: rgb(67, 67, 67); font-kerning: none; font-style: normal; font-weight: normal; margin: 18.6667px 0px 5.33333px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN-US\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eSkills you’ll gain\u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"134245418\":false,\"134245529\":false,\"335559738\":280,\"335559739\":80}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eRapid prototyping process \u003c\/span\u003e\u003cspan style=\"box-sizing: border-box; margin: 0; padding: 0; text-align: left;\"\u003edesign\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559738\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eMaterial and tool selection\u003c\/span\u003e\u003c\/li\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e3D printing, laser cutting, CNC routing\u003c\/span\u003e\u003cspan style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: WordVisiCarriageReturn_MSFontService, Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text; white-space: pre !important;\" class=\"LineBreakBlob BlobObject DragDrop SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eElectrical integration and microcontroller basics\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eEngineering design and visual communication with CAD\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559739\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; clear: both; cursor: text; direction: ltr; margin: 0px; overflow: visible; padding: 0px; position: relative; user-select: text;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp aria-level=\"3\" role=\"heading\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: rgb(67, 67, 67); font-kerning: none; font-style: normal; font-weight: normal; margin: 18.6667px 0px 5.33333px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eTarget audience\u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"134245418\":false,\"134245529\":false,\"335559738\":280,\"335559739\":80}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eEngineering students and early-career professionals in mechanical, electrical, or product design fields\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559738\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eTechnicians and makers working in prototyping labs or innovation hubs\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN-US\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eInnovations looking to protytpe physical solutions efficiently\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559739\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; clear: both; cursor: text; direction: ltr; margin: 0px; overflow: visible; padding: 0px; position: relative; user-select: text;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cul\u003e\n\u003cli style=\"margin-left: 0px;\"\u003e\n\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eTeams exploring low-cost, fast-cycle hardware development methods\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 16px 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN-US\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eNo prior experience is required. Content is designed for hands-on learners from varied backgrounds. \u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; clear: both; cursor: text; direction: ltr; margin: 0px; overflow: visible; padding: 0px; position: relative; user-select: text;\" class=\"OutlineElement Ltr SCXW21825373 BCX8\"\u003e\n\u003cp aria-level=\"3\" role=\"heading\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: rgb(67, 67, 67); font-kerning: none; font-style: normal; font-weight: normal; margin: 18.6667px 0px 5.33333px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan style=\"color: rgb(0,0,0);\"\u003e\u003cspan data-ccp-parastyle=\"heading 3\" lang=\"EN\" data-contrast=\"none\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; font-variant-ligatures: none !important; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eCourses and Descriptions\u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"134245418\":false,\"134245529\":false,\"335559738\":280,\"335559739\":80}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 13pt; line-height: 24.15px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-text-stroke-width: 0px; -webkit-user-drag: none; background-color: rgb(255, 255, 255); color: rgb(0, 0, 0); font-family: Arial, Arial_MSFontService, sans-serif; font-size: 14.6667px; font-style: normal; font-variant-caps: normal; font-variant-ligatures: normal; font-weight: 400; letter-spacing: normal; margin: 0px; orphans: 2; padding: 0px; text-align: left; text-decoration-color: initial; text-decoration-style: initial; text-decoration-thickness: initial; text-indent: 0px; text-transform: none; user-select: text; white-space: normal; widows: 2; word-spacing: 0px;\" class=\"SCXW21825373 BCX8\"\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eUsing Rapid Prototyping in the Engineering Design Process - \u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003eIntroduces the engineering design process and its application to open-ended problems. Includes methods for mock-up development, CAD basics, and prototype planning.\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props='{\"335559738\":240}' style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eAdding Electronics to Rapid Prototypes - \u003c\/strong\u003eExplains the fundamentals of circuits, breadboarding, multimeter use, and wire connections. Includes practical applications of motors, actuators, and microcontrollers.\u003c\/span\u003e\u003cbr\u003e\u003cspan data-ccp-props=\"{}\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"EOP SCXW21825373 BCX8\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; margin: 0px; padding: 0px; position: relative; user-select: text;\" class=\"ListContainerWrapper SCXW21825373 BCX8\"\u003e\n\u003cp style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; background-color: transparent; color: windowtext; font-kerning: none; font-style: normal; font-weight: normal; margin: 0px; overflow-wrap: break-word; padding: 0px; text-align: left; text-indent: 0px; user-select: text; vertical-align: baseline; white-space: pre-wrap;\" class=\"Paragraph SCXW21825373 BCX8\"\u003e\u003cspan lang=\"EN-US\" data-contrast=\"auto\" style=\"-webkit-tap-highlight-color: transparent; -webkit-user-drag: none; font-family: Arial, Arial_EmbeddedFont, Arial_MSFontService, sans-serif; font-size: 11pt; font-variant-ligatures: none !important; line-height: 20.7px; margin: 0px; padding: 0px; user-select: text;\" class=\"TextRun SCXW21825373 BCX8 NormalTextRun\"\u003e\u003cstrong\u003eRapid Prototyping Materials and Tooling - \u003c\/strong\u003eReviews materials like cardboard, plastic, wood, and aluminum, and their fabrication using traditional machining and CNC tools. Covers the pros and cons of different manufacturing technologies and their role in effective prototyping.\u003c\/span\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cp\u003e \u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106831466563,"sku":"18620","price":230.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/PrototypingTechniques-CAD_Fabrication_andMicrocontrollers__800x800_d83a23f8-6ddb-4e0b-a10c-8116d9b8c387.png?v=1776700860"},{"product_id":"vacuum-process-fundamentals","title":"Vacuum Process Fundamentals","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description\u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003ePresented in THORS' highly visual and interactive learning format, this course will help foundry employees become familiar with the important equipment processing steps associated with their profession.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eLearning Objectives\u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e•Understand the life of a casting manufactured by vacuum process molding.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e• Identify the equipment used in vacuum process molding.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e•Learn about the design considerations for pattern and mold making.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e•Comprehend the processes and procedures that define the vacuum process.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e•Diagnose the casting defects manufactured by the vacuum process.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 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65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eArtificial Intelligence (AI) continues to transform the MedTech and semiconductor landscapes, it brings forth a myriad of opportunities and challenges that demand careful attention to governance and compliance. 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255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-weight:400;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eEthical considerations and best practices\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-weight:400;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eEstablishing an AI governance program for your organization\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-weight:400;\"\u003e\n\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eFollow-through and enforcement\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/li\u003e\n\u003c\/ol\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Objectives \u003c\/strong\u003e \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDescribe what AI governance is\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eRecognize the evolving landscape of AI and privacy regulations\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eIdentify ethical considerations and best practices of AI in MedTech and semiconductor industries\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eApply practices and knowledge to establish an AI governance program\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDescribe AI governance program enforcement strategies\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e \u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e95 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians, and individuals working directly with biohybrid sensing, and\/or FlexTech community members.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106836447299,"sku":"18128","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800SUSU_LawMedTech_v1_1_321ef6da-5d12-4cec-915c-a57e2c9cf7ad.png?v=1776700975"},{"product_id":"semi113-biohybrid-sensing-systems-for-volatile-organic-compounds","title":"SEMI113 Biohybrid Sensing Systems for Volatile Organic Compounds","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cbr\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThe Department of Defense needs non-linear advances in the gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiologic changes present in human breath. Currently, fieldable instruments for gas analysis are large (\u0026gt;0.5 cubic ft.), expensive (\u0026gt;$50,000), and slow. Hand-held devices are limited to the identification of specific targets such as nitrogen oxide, oxygen, and carbon dioxide or generalized estimated concentration of total volatile organic compounds (VOCs). Biohybrid sensing involves combining biological sensory elements with electronic components in a SWaP-C solution for fast and accurate detection of VOCs. Unprecedented VOS sensing potential lies within the biological sense of olfaction, which boasts rapid, selective, and sensitive capability to identify hundreds of thousands of compounds in complex environments. However, there are currently no commercially available devices harnessing the capability of olfaction due to the challenges in the bioelectronic interacting necessary for maintaining long-term stability and environmental conditions necessary to sustain olfactory signaling elements (whether it be at the organ-, cell-, or protein level). This course will provide an overview of the current state of biohybrid VOC sensing comparing and contrasting examples utilizing olfactory organ\/tissue-based, cell-based, and protein-based modalities.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Objectives \u003c\/strong\u003e \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eUnderstanding the current state of biohybrid VOC sensing\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eCompare and contrast examples utilizing olfactory organ\/tissue-based and protein-based modalities\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDiscuss the status of non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes in human breath\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e120 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians, and individuals working directly with biohybrid sensing, and\/or FlexTech community members.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106836512835,"sku":"18126","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800SUSU_Biohyrbid_v1_1.png?v=1776700977"},{"product_id":"semi112-perspectives-on-biosense-applications","title":"SEMI112 Perspectives on Biosense Applications","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThe healthcare industry has transformed over the past twenty-five years due to the co-development of diagnostics along with state-of-the-art therapeutics and treatments; notably, this has led to the field of companion diagnostics. The best example of this is the prescribed use of insulin-based glucose levels which are monitored via test strips or the continuous glucose monitoring. The future goal of medicine is to have truly personalized treatment protocols based on an individual's biometers, physiology, and exposure. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eHowever, this goal required further identification and quantitation of biomarkers and health exposures, both biological and chemical, both at the point-of-care as well as in real-time. Therefore, technologies are needed that can miniaturize current diagnostics to make them inexpensive, simple to use, and ideally wearable. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eHowever, where and what to sense remains a critical question to solve, as each biofluid, including blood, sweat, saliva, tears, breath, and exhaled breath condensate contains a different profile of biomarkers. Additionally, biomarkers have vastly different physiochemical properties and abundances, which present different challenges as well as require a range of sensing modalities. Therefore, this course will overview the \"What, Where, and How of Sensing to Meet Current and Future MedTech Needs\". At the end of the course, a perspective of where these technologies can impact the future of health outcomes will be presented as well as key considerations for future technologies to gain commercial acceptance. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Objectives \u003c\/strong\u003e \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eRecognize that biosensor applications can meet current and future MedTech needs.\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain where biosensor applications can impact the future of health outcomes.\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDiscuss how biosensor applications work and how they can improve healthcare solutions. \u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e2 hr. 40 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians, MedTech professionals, anyone working with biosensor applications, and\/or FlexTech community members  \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106836545603,"sku":"18124","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/2048x2048SU_Biosensor_v1.png?v=1776700978"},{"product_id":"semi111-introduction-to-hybrid-bonding-for-advanced-packaging","title":"SEMI111 Introduction to Hybrid Bonding for Advanced Packaging","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\" id=\"isPasted\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThis course will discuss the meaning and the need for advanced packaging such as Chiplets, and 3D Stacked Systems, with a deep dive into Hybrid Bonding For many generations of technology nodes, Moore's Law has reliably delivered the doubling of transistor density every 1.5 to 2 years while bringing down the cost per transistor. However, in recent advanced nodes, Moore's Law has slowed down the cost of advanced nodes causing chips to increase.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e​\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eTo keep up with performance demands, manufacturers have continued to increase chip size to have large System on Chip (SoCs) causing chip sizes to reach the lithographic reticle limits. Moreover, increasing chip size beyond reticle limits also decreases chip yields and contributes to increasing the cost of manufacturing, thus increasing chip sizes beyond reticle limits.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThe semiconductor industry needs to be on the path to deliver more performance and functionality at reasonable prices despite the slowing of Moore's Law.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eOne popular approach the industry is adopting to deliver is focusing on Advanced Packaging, including the use of Chiplets, Hybrid Bonding, and state-of-the-art 3D Stack Systems. This course will discuss the meaning and need for Advanced Packaging and dive into each one of these Advanced Packaging approaches. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e​\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e​\u003cstrong style=\"box-sizing:border-box;\" id=\"isPasted\"\u003eCourse Objectives\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eRecognize the need for Advanced Packaging\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eIdentify the types of Advanced Packaging\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain 3D Bonding and the basics of Hybrid Bonding for Advanced Packaging\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\n\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eIdentify the types of Hybrid Bonding, the current status, and the challenges\u003c\/i\u003e\u003c\/em\u003e \u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDiscuss future opportunities in Hybrid Bonding\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e95 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians, or any individual working directly with this equipment or product  \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0in;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106836611139,"sku":"18122","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800SU_AdvancedPkg_v1_1.png?v=1776700978"},{"product_id":"semiconductor-industry-at-a-glance","title":"Semiconductor Industry at a Glance","description":"\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003eThis course covers industry foundational knowledge including the various segments that make up the market ecosystem, a few technological innovations that have led us to where we are today, the role that SEMI plays with the industry, and the value that the electronics industry brings on a global scale.\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Objectives \u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"box-sizing:border-box;line-height:normal;margin-bottom:0px;\"\u003eList the segments that make up the electronics and semiconductor industry.\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;line-height:normal;margin-bottom:0px;\"\u003eExplain how innovation has impacted electronics technologies.\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;line-height:normal;margin-bottom:0px;\"\u003eList SEMI's Tech Communities that support industry members.\u003c\/li\u003e\n\u003cli style=\"box-sizing:border-box;line-height:normal;margin-bottom:0px;\"\u003eDefine the value that the electronics industry has on national and global markets.\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e20 minutes\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003eManagers, supervisors, engineers, and technicians or any individual working directly with this equipment or product  \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003eNone\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106837692483,"sku":"17970","price":79.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/image2_800x800_d5e5c86a-4ee6-49ef-af63-d67b2144ca52.jpg?v=1776701002"},{"product_id":"leadframe-and-substrate-package-assembly-proce","title":"Leadframe and Substrate Package Assembly Process","description":"\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Description\u003c\/strong\u003e \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eThis course provides an overview of the leadframe and substrate package assembly processes. It provides an overview of the leadframe and substrate material before diving into the package assembly processes. The assembly processes of QFP leadframe and flip chip BGA package from wire bond, die-attach, and flip chip to package singulation will be shared in this course. \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Objectives\u003c\/strong\u003e \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eIdentify the materials in the leadframe and rigid substrate structure \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eDescribe the front-of-line assembly processes and defects \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eExplain the end-of-line assembly processes and defects \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eDescribe the typical leadframe and substrate assembly processes \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eExplain how the materials affect the assembly processes  \u003c\/i\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e70 minutes  \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eTarget Audience\u003c\/strong\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready. \u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003e\u003cstrong\u003eRequisite Audience\u003c\/strong\u003e\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:black;\"\u003e\u003ci\u003eAt least some college-level scientific knowledge\u003c\/i\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106838052931,"sku":"17946","price":119.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/231193d8-5b06-41b5-875d-2f87343ffdf1.jpg?v=1776701010"},{"product_id":"ic-packaging-beginner-certification","title":"IC Packaging - Beginner Level Certification","description":"\u003cdiv ccp_infra_version=\"3\" ccp_infra_timestamp=\"1716988392666\" ccp_infra_user_hash=\"1051031829\" ccp_infra_copy_id=\"1980f2d4-4af2-419b-9be3-c9f979c27198\" data-ccp-timestamp=\"1716988392666\"\u003e\n\u003cmeta http-equiv=\"Content-Type\" content=\"text\/html; charset=utf-8\"\u003e\n\u003cmeta name=\"ProgId\" content=\"Excel.Sheet\"\u003e\n\u003cmeta name=\"Generator\" content=\"Microsoft Excel 15\"\u003e\n\u003cstyle\u003etable\n\t{mso-displayed-decimal-separator:\"\\.\";\n\tmso-displayed-thousand-separator:\"\\,\";}\ntr\n\t{mso-height-source:auto;}\ncol\n\t{mso-width-source:auto;}\ntd\n\t{padding-top:1px;\n\tpadding-right:1px;\n\tpadding-left:1px;\n\tmso-ignore:padding;\n\tcolor:black;\n\tfont-size:11.0pt;\n\tfont-weight:400;\n\tfont-style:normal;\n\ttext-decoration:none;\n\tfont-family:Calibri, sans-serif;\n\tmso-font-charset:0;\n\ttext-align:general;\n\tvertical-align:bottom;\n\tborder:none;\n\twhite-space:nowrap;\n\tmso-rotate:0;}\n.xl17\n\t{white-space:normal;}\n\u003c\/style\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cbr\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Description \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eThe semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential. To address this increased potential of the semiconductor industry, this beginner’s level curriculum prepares learners for a career in semiconductor manufacturing with a focus on integrated chip (IC) packaging. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eIC Packaging requires interdisciplinary knowledge, such as mechanical, materials, chemical, and electronics engineering. This curriculum aims to bring things from this interdisciplinary lens by teaching foundational concepts, PCB, board assembly, soldering, and leadframe and substrate package assembly.  Engineers who complete this certification are more ready to take on issues they encounter in the field during the design and manufacturing operations. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eAt the end of the training, learners must complete the final exam to receive certification. This exam will consist of 100 questions. Learners have up to three attempts to pass the exam. A passing score of 75% is required.  If you do not pass the test after three attempts, you must re-enroll in the curriculum. This certification is valid for three years and is issued by SEMI. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\" id=\"isPasted\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eThe IC Packaging Beginner’s Certification includes 3 courses. \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eThese individual courses can be purchased separately, but this is the only bundle that includes a summative exam. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Objectives \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eSummarize introductory concepts of integrated chip packaging\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eExplain PCB, board assembly, and soldering functions and constituents\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eIdentify various assembly processes \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Duration\u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e3.5 hours, Certification exam 1.5 hours\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can take advantage of this curriculum to ensure their workforce is ready.\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eAt least some college-level scientific knowledge \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/div\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106840346691,"sku":"17571","price":299.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/semi_image_generator_4_becb05f9-37eb-4909-a89f-96c3c23b12c0.webp?v=1776701046"},{"product_id":"introduction-to-semi-e187-spec-for-cybersecurity-of-fab-equipment","title":"Introduction to SEMI E187- Spec for Cybersecurity of Fab Equipment","description":"\u003cp\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eThe course “Introduction to Semiconductor Equipment Cybersecurity Standard – SEMI E187- Specification for Cybersecurity of Fab Equipment\" delves into the framework, scope, and four major aspects covered by SEMI E187. This will enable participants to gain a comprehensive understanding of semiconductor equipment cybersecurity standards. The course provides professional knowledge and practical case studies to aid participants in applying SEMI E187 cybersecurity standards effectively in the semiconductor equipment domain, thereby enhancing equipment security capabilities.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"background-color:white;color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eThis course overviews the following:\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eSEMI E187 Framework: Introducing the composition and structure of SEMI E187 standard.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eSEMI E187 Scope: Explaining the scenarios and scope of SEMI E187, including it’s application in the semiconductor manufacturing process.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eFour Major Aspects of SEMI E187: Discussing the four key cybersecurity aspects addressed by SEMI E187\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eApplication of SEMI E187 Standard: Presenting real-world applications of SEMI E187 standard in semiconductor equipment.\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Objectives \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eBy the end of this course, participants will be able to:\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eExplain the framework of SEMI E187.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eDescribe the scope of SEMI E187.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eDiscuss the four major aspects of SEMI E187.\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e25 minutes\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eIndividuals interested in semiconductor equipment cybersecurity. Professional with a foundational background in cybersecurity and knowledge of semiconductor equipment as this will facilitate a deeper understanding of the course content.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eLanguage\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eChinese (with English subtitles)\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;margin:0in;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eNone\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106841755715,"sku":"17355","price":89.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800_Shopify_Cybersecurity_1_4b81a500-c3ec-40a3-8c19-d5c73f3e03f2.png?v=1776701077"},{"product_id":"pcb-board-assembly-and-its-soldering","title":"PCB, Board Assembly and Its Soldering","description":"\u003cp\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eThe semiconductor industry provides \u003c\/span\u003e\u003c\/span\u003e\u003cspan style=\"background-color:rgba(0,0,0,0);color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003ecritical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices and the automotive industry show signs of increased potential. The course provides foundational knowledge of PCBs, the board assembly process and soldering. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"background-color:rgba(0,0,0,0);color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eThis course is the second course of the IC Packaging curriculum for beginners. By learning about the concepts taught, engineers can take on more issues they encounter in their design and manufacturing operation. After all, IC packaging requires interdisciplinary knowledge, such as mechanical, materials, chemical and electronics engineering.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Objectives \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eDescribe how through hole technology and wave soldering functions.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eExplain what surface mount technology and reflow soldering are. \u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eSummarize PCB and its materials.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eIdentify the constituents of solder paste.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eDescribe what eutectic solder is.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli type=\"disc\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eInterpret the selection of lead-free solders and its mechanism.\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e40 minutes\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eSales engineers\/business development executives, and college students who are interested in joining the semiconductor industry, especially OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can also take up this course to be more workforce ready. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style=\"color:#414141;\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.5pt;'\u003eFirst or second year college level science background students.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106841854019,"sku":"17328","price":119.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/33e611d1-c314-4b67-b7b7-779152c13199_5ac6cae2-4c9d-489d-aded-0e4749323598.jpg?v=1776701079"},{"product_id":"introduction-to-ic-packaging","title":"Introduction to IC Packaging","description":"\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/p\u003e\u003cp line-height:=\"\"\u003eThe semiconductor industry provides \u003cspan background-color:=\"\"\u003ecritical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices and the automotive industry show signs of increased potential. The course provides an overview of semiconductor devices that are packaged to meet the size, cost and package performance to meet the various applications.  The package performance includes electrical, thermal and reliability to meet the growth of the semiconductor demands in this application.  Those interested in IC packaging will learn about the functions of IC packaging and existing BGA, CSP 3D packaging, WLP packaging etc. to meet the semiconductor application needs. This course is the first course of the IC Packaging curriculum for beginners. By learning about the concepts taught in this course, engineers can take more issues they encounter in their design and manufacturing operation.  Afterall, IC packaging required interdisciplinary knowledge, such as mechanical, materials, chemical and electronics engineering.  \u003c\/span\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCourse Objectives \u003c\/strong\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eExplain the functionality of microelectronics packaging.\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eReview the various packaging trends over time.\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eDescribe system packaging and heterogeneous integration.\u003c\/li\u003e\n\u003cli margin-top:=\"\" type=\"\"\u003eIdentify the main challenges in packaging.  \u003c\/li\u003e\n\u003c\/ul\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e90 minutes\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry especially OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can take advantage of this course to ensure their workforce is ready. \u003c\/p\u003e\u003cp margin-bottom:=\"\" line-height:=\"\"\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/p\u003e\u003cp line-height:=\"\"\u003eNone\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eBiography\u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-top:0px;orphans:2;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"font-size:12px;\"\u003eDr. Lee Teck Kheng received the B.S. degree in Mechanical Engineering and a M.S. Degree in Materials Science and Engineering from the National Univ. of Singapore in 1995 and 1999 respectively and a Ph.D. degree in Mechanical and Aerospace Engineering from Nanyang Technology Univ., Singapore in 2006. He founded Technology Development Centre at ITE College Central. He drives ITE innovations with the development of strategic plans and organization re-structure for innovation. This setup ITE Technology Transfer office in 2018 and collaborate with various Institute of higher IEOs to catalyst Singapore Research Innovation Enterprise Initiative. He has led a team of 20 engineers and research to support the nations initiative of Research Innovation Enterprise for ITE. The centre awarded $3M competitive grants and more than 500 industry projects at $4M. In 1999, he joined Micron Semiconductor Asia Pte. Ltd. and was promoted to Senior Technical Member. He was responsible for substrate supplier management and leading research programs in the field of advanced packaging and material characterization. His past experience included pioneering MEMS packaging and initiating Chip scale packaging and flip chip packaging with his stay in A-star Institue of Microelectronics from 1997-1999.  \u003c\/span\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-top:0px;orphans:2;text-align:justify;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cspan style=\"font-size:12px;\"\u003eHe has authored and co-authored more than 60 papers in journal and international conference. Currently, he holds 74 U.S. patents, pending another 20 patents from issuing. He serves as a current\/past committee member for Singapore Chinese Chamber of Commerce, SEMI and SSIA, IEEE semiconductor group, EPTC. Currently he leads the aligning of international standard committee member for semiconductor under IEC TC47. He taught as a part-time lecturer in NTU for Microelectronics packaging since 2009-2014. He is also a member of IEEE, CPMT, IES, Material Research Society and IMPAS societies. He also performed several overseas workshops as well as honor in Marquis Who's Who (2008-2020) and International Biographical Centre.\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106841952323,"sku":"17304","price":119.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/2048x2048ICPackaging_1.png?v=1776701082"},{"product_id":"semi110-a-new-approach-to-robotics-designing-for-additive-manufacturing","title":"SEMI110 A New Approach to Robotics: Designing for Additive Manufacturing","description":"\u003cp\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003eAre you wondering how fabricating robots using additive design and manufacturing methods has the potential to transform the industry? This course will discuss how to make electromechanical systems (robots) easier to design and fabricate so that we can enable people who are application experts (but not necessarily robot design or fabrication experts) to create robots for their specific needs rapidly. \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003eAfter all, current electromechanical design practice is predicated on exercising expert-level judgment through an interactive and iterative design and fabrication process that requires skilled humans at every step.  This approach doesn't scale because it is labor intensive and biases robots toward longer-lasting, more general-purpose, and expensive designs to justify the development and fabrication costs. \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003eTake this course to explore the potential applications and how to use new design tools, 3D printing methods, and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems. This course will provide you with new ways to approach manufacturing, additive design, and the role of robots. \u003cbr\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003ePlease note this course was initially hosted as a Flextech Community Master Class led by Dr. Robert MacCurdy and Prof. Greg Whiting of the Univ. of Colorado, Boulder, hosted by Gity Samad, Ph.D. \u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eCourse Objectives \u003c\/strong\u003e \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDescribe the current state of robots in the market.\u003c\/li\u003e\n\u003cli\u003eExplain the value that soft robotics could bring to the field.\u003c\/li\u003e\n\u003cli\u003eIdentify components and benefits of robotics printing processes, methods, and techniques. \u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e1 hr. 40 minutes\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003eManagers, supervisors, engineers, technicians, or any individual working directly with this equipment or product.\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;\"\u003eNone\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106844016707,"sku":"16992","price":45.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/Robotics_6c81e358-ef8d-4f19-bd46-3cf80961f402.jpg?v=1776701116"},{"product_id":"semi-002-introduction-to-ritdb-semi-e183-implementation-on-a-test-floor","title":"SEMI 002 Introduction to RITdb (SEMI E183) Implementation on a Test Floor","description":"\u003cp\u003e\u003ci\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/i\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003eLooking to take advantage of Industry 4.0 to bring order to the chaos of your semiconductor test process?  Or perhaps you're a little familiar with the SEMI E183 Standard but want to know more about it?  Take this course to learn more.\u003c\/i\u003e      \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003eThis course will provide you with an overview of the Rich Interactive Test database (RITdb) standard and walk you through the technicalities of the proof of concepts and will explain the features in a client that supports the standard. Think of this course as a guide to help you bring order to the chaos in your testing process.  The results will improve your testing productivity.  \u003c\/i\u003e      \u003c\/p\u003e\u003cp\u003e\u003ci\u003e\u003cstrong\u003eCourse Objectives \u003c\/strong\u003e \u003c\/i\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e\u003ci\u003eExplain the Rich Interactive Test database (RITdb) SEMI Standard specification (E183).\u003c\/i\u003e\u003c\/li\u003e\n\u003cli\u003e\u003ci\u003eIdentify the technical details of the proof of concepts. \u003c\/i\u003e\u003c\/li\u003e\n\u003cli\u003e\u003ci\u003eDescribe the features in the client that meet the E183 standard. \u003c\/i\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003e\u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003e90 minutes\u003c\/i\u003e      \u003cbr\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians, or any new individuals working directly with E183 standard. Anyone wanting a refresher on the standard.\u003c\/i\u003e      \u003cbr\u003e \u003c\/p\u003e\u003cp style=\"line-height:normal;margin-bottom:0in;\"\u003e\u003ci\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/p\u003e\u003cp style=\"line-height:normal;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106846670915,"sku":"16787","price":50.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/229x173-E183-Course.jpg?v=1776701209"},{"product_id":"semi001-introduction-to-implementing-a-test-cell-ritdb-client","title":"SEMI001 Introduction to Implementing a Test Cell RITdb Client","description":"\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003ci\u003e\u003cspan\u003e\u003cstrong\u003eCourse Description \u003c\/strong\u003e\u003c\/span\u003e\u003c\/i\u003e\u003cspan data-ccp-props='{\"134233118\":true,\"201341983\":0,\"335559739\":160,\"335559740\":240}' data-sanitized-data-ccp-props='{\"134233118\":true,\"201341983\":0,\"335559739\":160,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003eLooking to take advantage of Industry 4.0 to bring order to the chaos of your semiconductor test process?  If so, take this course! This course teaches you how to implement tester portals and clients based on a new SEMI standard for sharing test floor data and events.  As you may know, Industry 4.0 brings machine-to-machine IOT, human augmentation, cloud, edge, and AI together, enabling a better manufacturing process.  Before taking advantage of these technologies, we need an efficient means to share the very complex and wide-ranging data vantage of technologies; we need an efficient means to share the very complex and wide-ranging data created and used on the test floor. This data comes from many sources and has latency and security issues with constantly changing sources and applications.  RITdb solves the sharing issues via an extensible machine focused on data structures and transport formats.  These formats have been validated in an advanced test environment.\u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003ePlease note that this course was originally hosted as a SEMI webinar and workshop led by Stacy Ajouri, Mark Roos, Michelle Sun, and Paul Trio in January 2023.\u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003e\u003cstrong\u003eCourse Objectives \u003c\/strong\u003e \u003c\/span\u003e\u003cspan data-ccp-props='{\"134233118\":true,\"201341983\":0,\"335559739\":160,\"335559740\":240}' data-sanitized-data-ccp-props='{\"134233118\":true,\"201341983\":0,\"335559739\":160,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan\u003eExplain the need for a new task force charter.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan\u003eIdentify the key components of RITdb topology.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan\u003eExplain the various features of a tester portal.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan\u003eOrder high-level steps in the event model\u003c\/span\u003e\u003c\/li\u003e\n\u003cli style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan\u003eRecognize the requirements satisfied by E183.\u003c\/span\u003e\u003c\/li\u003e\n\u003cli style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan\u003eExplain how to send an E183 Event.\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003e \u003cstrong\u003eCourse Duration\u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003e90 minutes\u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003eManagers, supervisors, engineers, technicians, or any individual working directly with this equipment or product  \u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px 0px 1rem;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/span\u003e\u003cspan data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}' data-sanitized-data-ccp-props='{\"201341983\":0,\"335559739\":0,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e\u003cp style='-webkit-text-stroke-width:0px;color:rgb(31, 33, 36);font-family:-apple-system, BlinkMacSystemFont, \"San Francisco\", \"Segoe UI\", Roboto, \"Helvetica Neue\", sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin:0px;orphans:2;text-align:start;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cspan data-contrast=\"none\" data-sanitized-data-contrast=\"none\"\u003eNone\u003c\/span\u003e\u003cspan data-ccp-props='{\"134233118\":true,\"201341983\":0,\"335559739\":160,\"335559740\":240}' data-sanitized-data-ccp-props='{\"134233118\":true,\"201341983\":0,\"335559739\":160,\"335559740\":240}'\u003e \u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106850799683,"sku":"16521","price":50.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMIU_Shopify_TestCell.png?v=1776701242"},{"product_id":"flexible-printed-electronics-bundle","title":"Flexible \u0026 Printed Electronics Bundle","description":"\u003cp\u003e\u003cstrong\u003e\u003cem\u003eCourse Description \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThis bundle consists of seven courses.  In this bundle will cover the following topics: 1. Flexible Power Sources: Challenges, Progress, and Integration, 2. Hybrid Integration Techniques for Flexible Electronics, 3. Flexible Batteries, 4. Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer 5. Packaging, Printing, Curing and Characterization Methods for Printable Conductors, 6. FHE for Medical \u0026amp; Industrial Application, 7.Next Generation of Printed Electronics. Electronics. \u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eTopics covered include the following: Review challenges and programs for new power supplies, basics of battery terminology, chemistry and structures relevant to flexible electronics, how new packaging paradigms like chiplets and dielets are impacting flexible hybrid electronics (FHE), basics of using printable conductors for additive manufacture of circuits on polymer substrates, best-known methods for optimizing flexible electronics into medical devices and industrial products, and latest materials and equipment advancement for next-gen printed electronics.\u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eCourse Objectives \u003c\/em\u003e\u003c\/strong\u003e\u003cem\u003e \u003c\/em\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\u003cem\u003eReview challenges and programs for new power supplies that are emerging to meet the needs of the FHE community.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eLearn the basics of battery terminology and unique challenges related to using and manufacturing flexible batteries.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eUnderstand challenges associated with scaling FHE, including adopting dielet technology in advanced CMOS nodes. \u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eOverview of traditional and digital printing methods, drying, curing, sintering, and design and assembly differences compared to traditional printed circuit boards.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003ePresents important considerations when designing flexible and printable parts and circuits.\u003c\/em\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cem\u003eProvides basics of PFHE processing technologies from dispensing and inkjet printing to roll-to-roll printing and coating.\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e \u003cstrong\u003e\u003cem\u003eCourse Duration\u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003e5.25 hours\u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eTarget Audience \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eManagers, supervisors, engineers, technicians or any individual working directly with this equipment or product  \u003c\/em\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cem\u003eRequisite Knowledge \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eNone\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106851520579,"sku":"16462","price":580.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/ShopifyTIle22048x2048_F_PE.png?v=1776701254"},{"product_id":"ai-data-bundle","title":"AI \u0026 Data Bundle","description":"\u003cp\u003e\u003cstrong\u003e\u003cem\u003eCourse Description \u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThis bundle consists of two SEMI courses.  The SEMI Flexible Power Sources course and the SEMI Hybrid Integration Techniques for Flexible Electronics course.  As new materials and processes emerge to enable the integration of high-performance micro-electronics into paper-thin, flexible hybrid electronics (FHT), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.  Among the key challenges is achieving high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. 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