{"product_id":"ic-packaging-intermediate-certification","title":"IC Packaging - Intermediate Level Certification","description":"\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eIt's highly recommended that you complete the Beginner Level of IC Packaging Bundle and Certification Exam before registering for this course content.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCurriculum Description \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eThis intermediate-level curriculum is designed for engineers and professionals seeking a deeper understanding of integrated circuit (IC) packaging technologies. As the semiconductor industry continues to evolve and expand across sectors usch as consumer electronics, communications, automotive, and medical devices, mastering the intricacies of IC packaging becomes essential. This bundle includes four comprehensive courses that explore critical components and processes involved in IC packaging:\u003cstrong style=\"box-sizing:border-box;\"\u003e Interposers and Its Processes, Interconnects and Its Processes, Front-End Assembly Line Processes, and Back-End of Line Assembly Processes.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eBy completing this curriculum, learners will gain interdisciplinary knowledge spanning mechanical, materials, chemical, and electronics engineering, empowering them to address complex challenges in design and manufacturing operations.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eAt the end of the training, learners must complete the final exam to receive certification. This exam will consist of 100 questions. Learners have up to three attempts to pass the exam. A passing score of 75% is required. If you do not pass the test after three attempts, you must re-enroll in the curriculum. This certification is valid for three years and is issued by SEMI.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourses Included\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eInterposers and Its Processes \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eExplore the foundational role of Interposers in IC Packaging. This course covers various interposer types- leadframe, ceramic, silicon glass, rigid substrate, and flex-and their respective fabrication flows. Learners will understand the functions and development of interposers and how they influence packaging performance and reliability. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eFunctions of interposers\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eLeadframe and ceramic fabrication flows\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eSilicon and glass interposers\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eRigid and flex substrates\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eInterposer development processes\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eInterconnects and Its Processes\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eDive into the technologies that enable electrical connections within microelectronic packages. This course provides a comparative analysis of wirebonding, tape automated bonding (TAB), and flip chip technologies, highlighting their applications, advantages, and process flows. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eWirebonding technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eTape automated bonding (TAB)\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eFlip chip technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eComparative analysis of interconnect methods\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eFront of Line Assembly Processes\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eLearn about the front-of-line packaging assembly concepts such as key package assembly technologies of backgrinding, dicing, and die attach device. Their various processes, materials, and future direction to meet the semiconductor application needs. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eBackgrinding technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eDicing technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eDie attach technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eComparative analysis of interconnect methods\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eBack-End of Line Assembly Processes\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eGain insights into the final stages of IC packaging assembly. This course focuses on the assembly processes for wirebond leadframe and flip chip on substrate packages, including molding, underfilling, pating, ball attach,, and PCB assembly. Learners will explore the materials, process parameters, and reliability considerations essential for high-performance packaging.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eKey Topics:\u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eMolding technologies\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eUnderfilling and encapsulants for flip chips\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003ePlating for leadframe\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eBall attach and intermetallic\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin:0px 0px 5pt 0.5in;text-indent:-0.25in;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003ePCB Assembly  \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCurriculum Duration \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e4.5 hours, Certification exam 1.5 hours\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eThis curriculum is ideal for intermediate-level engineers, technicians, and professionals in the semiconductor packaging, manufacturing, and design roles who are looking to expand their technical expertise and stay ahead in a rapidly evolving industry. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;margin-top:0px;\"\u003e\u003cspan style=\"font-size:14px;\"\u003e\u003cspan style=\"box-sizing:border-box;\"\u003eThe passing of the IC Packaging Beginner Level certification exam, OR a sufficient understanding of introductory concepts of IC Packaging, PCB board assembly, and soldering, and general assembly processes.\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"box-sizing:border-box;margin-top:0px;\"\u003e \u003c\/p\u003e\n\u003c\/div\u003e\u003c\/div\u003e\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\n\u003cbr\u003e \u003c\/div\u003e","brand":"Dr. Lee Teck Kheng","offers":[{"title":"Default Title","offer_id":43106830843971,"sku":"18708","price":265.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/semi_image_generator_5_9df5daa9-0b26-4047-9392-898dea1241be.webp?v=1776700842","url":"https:\/\/store-dev2.semi.org\/en-nl\/products\/ic-packaging-intermediate-certification","provider":"SEMI Dev 2","version":"1.0","type":"link"}