{"product_id":"ic-packaging-beginner-certification","title":"IC Packaging - Beginner Level Certification","description":"\u003cdiv ccp_infra_version=\"3\" ccp_infra_timestamp=\"1716988392666\" ccp_infra_user_hash=\"1051031829\" ccp_infra_copy_id=\"1980f2d4-4af2-419b-9be3-c9f979c27198\" data-ccp-timestamp=\"1716988392666\"\u003e\n\u003cmeta http-equiv=\"Content-Type\" content=\"text\/html; charset=utf-8\"\u003e\n\u003cmeta name=\"ProgId\" content=\"Excel.Sheet\"\u003e\n\u003cmeta name=\"Generator\" content=\"Microsoft Excel 15\"\u003e\n\u003cstyle\u003etable\n\t{mso-displayed-decimal-separator:\"\\.\";\n\tmso-displayed-thousand-separator:\"\\,\";}\ntr\n\t{mso-height-source:auto;}\ncol\n\t{mso-width-source:auto;}\ntd\n\t{padding-top:1px;\n\tpadding-right:1px;\n\tpadding-left:1px;\n\tmso-ignore:padding;\n\tcolor:black;\n\tfont-size:11.0pt;\n\tfont-weight:400;\n\tfont-style:normal;\n\ttext-decoration:none;\n\tfont-family:Calibri, sans-serif;\n\tmso-font-charset:0;\n\ttext-align:general;\n\tvertical-align:bottom;\n\tborder:none;\n\twhite-space:nowrap;\n\tmso-rotate:0;}\n.xl17\n\t{white-space:normal;}\n\u003c\/style\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cbr\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Description \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eThe semiconductor industry provides critical enabling technology for many products and fields and has been in periods of rapid growth.  While electronics goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential. To address this increased potential of the semiconductor industry, this beginner’s level curriculum prepares learners for a career in semiconductor manufacturing with a focus on integrated chip (IC) packaging. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eIC Packaging requires interdisciplinary knowledge, such as mechanical, materials, chemical, and electronics engineering. This curriculum aims to bring things from this interdisciplinary lens by teaching foundational concepts, PCB, board assembly, soldering, and leadframe and substrate package assembly.  Engineers who complete this certification are more ready to take on issues they encounter in the field during the design and manufacturing operations. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eAt the end of the training, learners must complete the final exam to receive certification. This exam will consist of 100 questions. Learners have up to three attempts to pass the exam. A passing score of 75% is required.  If you do not pass the test after three attempts, you must re-enroll in the curriculum. This certification is valid for three years and is issued by SEMI. \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\" id=\"isPasted\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eThe IC Packaging Beginner’s Certification includes 3 courses. \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eThese individual courses can be purchased separately, but this is the only bundle that includes a summative exam. \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Objectives \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eSummarize introductory concepts of integrated chip packaging\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eExplain PCB, board assembly, and soldering functions and constituents\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eIdentify various assembly processes \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eCurriculum Duration\u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e3.5 hours, Certification exam 1.5 hours\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eTarget Audience \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can take advantage of this curriculum to ensure their workforce is ready.\u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eRequisite Knowledge \u003c\/strong\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:white;\"\u003e\u003cspan style=\"color:#1A1A1A;\"\u003e\u003cspan style='font-family:\"Aptos\",sans-serif;font-size:10.0pt;'\u003eAt least some college-level scientific knowledge \u003c\/span\u003e\u003c\/span\u003e\u003cspan\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/div\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":43106840346691,"sku":"17571","price":265.95,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/semi_image_generator_4_becb05f9-37eb-4909-a89f-96c3c23b12c0.webp?v=1776701046","url":"https:\/\/store-dev2.semi.org\/en-nl\/products\/ic-packaging-beginner-certification","provider":"SEMI Dev 2","version":"1.0","type":"link"}