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SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling
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SEMI G38 - 静止空気および強制風冷によるICパッケージのジャンクション部周囲間の熱抵抗の測定法
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SEMI D29 - 平面顯示螢幕(FPD)彩色濾光片耐熱性計算之測試法
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SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages
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SEMI P14 - 黒鉛炉原子吸光分光法によるポジティブフォトレジスト中の錫の測定
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SEMI P19 - Specification for Metrology Pattern Cells for Integrated Circuit Manufacture
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SEMI G65 - Lリード（ガルウイング型）パッケージ用リードフレーム材料の評価の試験方法
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SEMI C21 - 水酸化アンモニウムの仕様とガイドライン
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SEMI PV1 - 高分解能グロー放電質量分析を用いたシリコン太陽電池用シリコン原料中の微量元素測定に関するテスト方法
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SEMI C39 - Specification for Potassium Hydroxide Pellets
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SEMI F20 - 高純度および超高純度の半導体製造アプリケーションで使用される汎用コンポーネント用の316Lステンレス鋼の棒鋼，鍛造品，押出成形品，鋼板，鋼管の仕様
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SEMI M37 - 低転位密度Inp基板のエッチピット密度（EPD）測定方法
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SEMI P47 - Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
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SEMI MF1723 - Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy
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SEMI M31 - 300 mmウェーハの搬送および出荷用フロントオープニング・シッピングボックスの機械仕様
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SEMI M80 - 450 mmウェーハの搬送および出荷用フロントオープニング・シッピングボックスの機械仕様
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SEMI M18 - Format for Silicon Wafer Specification Form for Order Entry
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SEMI M29 - 300 mmシッピングボックスの仕様
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SEMI C3.56 - ジボラン混合ガスの仕様
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SEMI P43 - Photomask Qualification Terminology
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SEMI P3 - レジスト付きクロムブランク
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SEMI P35 - Terminology for Microlithography Metrology
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SEMI M32 - 統計的仕様のガイド
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SEMI P10 - Specification of Data Structures for Photomask Orders
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Non-Member Price: €171,95