SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carri – Page 93

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HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes

SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes

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M05600 - SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias

SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias

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G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds

SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds

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MF213900 - SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry

SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry

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F02200 - SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems

SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems

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G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer

SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer

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G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape

SEMI G75 - Standard Test Method of the Properties of Leadframe Tape

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G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology

SEMI G57 - Guide for Standardization of Leadframe Terminology

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G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes

SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes

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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding

SEMI G73 - Test Method for Pull Strength for Wire Bonding

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G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes

SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes

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Non-Member Price: €171,95

HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port

SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port

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Non-Member Price: €171,95

M07000 - SEMI M70 - パーシャルサイト平坦度を使ってウェーハのエッジ近傍形状を決定するための作業方法

SEMI M70 - パーシャルサイト平坦度を使ってウェーハのエッジ近傍形状を決定するための作業方法

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F02600 - SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases

SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases

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HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices

SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices

Member Price: €113,00
Non-Member Price: €171,95