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1222 products

G09100 - SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog
SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog Sale priceMember Price: €113,00
Non-Member Price: €171,95
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
F11700 - SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems
MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices
SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Sale priceMember Price: €113,00
Non-Member Price: €171,95
F11400 - SEMI F114 - Test Method for the Determination of Organic Contaminants Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: €135,00
Non-Member Price: €159,95
E17800 - SEMI E178 - Guide for EDA Freeze Version
SEMI E178 - Guide for EDA Freeze Version Sale priceFrom €171,95 EUR
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications
PV08800 - SEMI PV88 - 惰性气体熔融红外吸收法测定光伏多晶硅中氢含量的测试方法
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
MS01300 - SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process
A00400 - SEMI A4 - Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)
G00300 - SEMI G3 - 仕様 側面ろう付け積層板
SEMI G3 - 仕様 側面ろう付け積層板 Sale priceMember Price: €135,00
Non-Member Price: €204,95
C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals
F11600 - SEMI F116 - Guide for Drain Segregation for Semiconductor Manufacturing Tools to Support Site Water Reuse
G06100 - SEMI G61 - Specification for Cofired Ceramic Packages
SEMI G61 - Specification for Cofired Ceramic Packages Sale priceMember Price: €113,00
Non-Member Price: €133,95
HB01300 - SEMI HB13 - Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface
SEMI HB13 - Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface Sale priceMember Price: €113,00
Non-Member Price: €171,95
G00900 - SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム
E17700 - SEMI E177 - Specification for Transmission Electron Microscope (TEM) Lamella Carriers Used in Electron Microscopy Workflows
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: €225,00
Non-Member Price: €337,95
G04700 - SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes
SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes Sale priceMember Price: €113,00
Non-Member Price: €133,95
E18300 - SEMI E183 - Specification for Rich Interactive Test Database (RITdb)
SEMI E183 - Specification for Rich Interactive Test Database (RITdb) Sale priceMember Price: €113,00
Non-Member Price: €171,95
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