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PV09700 - SEMI PV97 - Specification for Silicon Powder Used in Polysilicon Production
SEMI PV97 - Specification for Silicon Powder Used in Polysilicon Production Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00800 - SEMI G8 - 金めっきの試験方法
SEMI G8 - 金めっきの試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
P00900 - SEMI P9 - マイクロエレクトロニクス用レジストの機能的なテスト（ガイドライン）
SEMI P9 - マイクロエレクトロニクス用レジストの機能的なテスト（ガイドライン） Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
E18200 - SEMI E182 - Specification for Panel FOUP Load Port for Panel Level Packaging
SEMI E182 - Specification for Panel FOUP Load Port for Panel Level Packaging Sale priceFrom ₩290,000 KRW
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
F11400 - SEMI F114 - Test Method for the Determination of Organic Contaminants Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
SEMI F114 - Test Method for the Determination of Organic Contaminants Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Regular price₩451,000 KRW Sale price₩290,000 KRW
G09100 - SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog
SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E17800 - SEMI E178 - Guide for EDA Freeze Version
SEMI E178 - Guide for EDA Freeze Version Sale price Member Price : ₩113
M08900 - SEMI M89 - Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method
SEMI M89 - Test Method for Recombination Lifetime of the Epilayer of the Silicon Epitaxial Wafer (p/p+, n/n+) by the Short Wavelength Excitation Microwave Photoconductive Decay Method Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices
SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E04400 - SEMI E44 - Guide for Procurment and Acceptance of Minienvironments
SEMI E44 - Guide for Procurment and Acceptance of Minienvironments Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F11700 - SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems
SEMI F117 - Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G07200 - SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様
SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩271,000
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
PV09200 - SEMI PV92 - Test Method for Extension of Flexible Thin Film Photovoltaic (PV) Modules
SEMI PV92 - Test Method for Extension of Flexible Thin Film Photovoltaic (PV) Modules Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G00600 - SEMI G6 - Test Method for Seal Ring Flatness
SEMI G6 - Test Method for Seal Ring Flatness Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
E17900 - SEMI E179 - Specification for Protocol Buffers Common Components
SEMI E179 - Specification for Protocol Buffers Common Components Sale price Member Price : ₩113
3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications
SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: ₩113
Non-Member Price: ₩226,000
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