SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD
SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F02300 - SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen
SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M07500 - SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers
SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F07800 - SEMI F78 - Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications
SEMI F78 - Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications Sale priceMember Price: ₩225
Non-Member Price: ₩571,000
M06400 - SEMI M64 - 赤外線吸収スペクトル法による絶縁（SI）ガリウムヒ素単結晶内のEL2深いドナー濃度の試験方法
SEMI M64 - 赤外線吸収スペクトル法による絶縁（SI）ガリウムヒ素単結晶内のEL2深いドナー濃度の試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
M03500 - SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド
SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
F04400 - SEMI F44 - Specification for Machined Stainless Steel Weld Fittings
SEMI F44 - Specification for Machined Stainless Steel Weld Fittings Sale price Member Price : ₩113
F05100 - SEMI F51 - Guide for Elastometric Sealing Technology
SEMI F51 - Guide for Elastometric Sealing Technology Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
M08800 - SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods
SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
F04500 - SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings
SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings Sale price Member Price : ₩113
M06100 - SEMI M61 - 埋め込み層付きシリコンエピタキシャルウェーハの仕様
SEMI M61 - 埋め込み層付きシリコンエピタキシャルウェーハの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000