SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

S01000 - SEMI S10 - 위험성 평가 및 위험성 검토 절차 안전 가이드라인
SEMI S10 - 위험성 평가 및 위험성 검토 절차 안전 가이드라인 Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
E01600 - SEMI E16 - マスフローコントローラ漏洩率の決定および記述のガイド
SEMI E16 - マスフローコントローラ漏洩率の決定および記述のガイド Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
E05200 - SEMI E52 - デジタルマスフローコントローラで使用されるガス，ガス混合物および気化して使用する材料の参照表
SEMI E52 - デジタルマスフローコントローラで使用されるガス，ガス混合物および気化して使用する材料の参照表 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
E08100 - SEMI E81 - Provisional Specification for CIM Framework Domain Architecture
SEMI E81 - Provisional Specification for CIM Framework Domain Architecture Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F08800 - SEMI F88 - 1.5インチタイプサーフェスマウント型ガス供給システム用スタンダードサイズマスフローコントローラ／マスフローメータの寸法のための仕様
SEMI F88 - 1.5インチタイプサーフェスマウント型ガス供給システム用スタンダードサイズマスフローコントローラ／マスフローメータの寸法のための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
F07100 - SEMI F71 - Test Method for Temperature Cycle of Gas Delivery System
SEMI F71 - Test Method for Temperature Cycle of Gas Delivery System Regular price₩452,000 KRW Sale price₩291,000 KRW
S00200 - SEMI S2 - Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S2 - Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Sale price Member Price : ₩225
S02200 - SEMI S22 - Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment
SEMI S22 - Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Sale priceMember Price: ₩225
Non-Member Price: ₩573,000
S00800 - SEMI S8 - Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
SEMI S8 - Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment Sale priceMember Price: ₩225
Non-Member Price: ₩573,000
E06200 - SEMI E62 - Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI E62 - Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS) Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
T00700 - SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol Sale price Member Price : ₩113
S02100 - SEMI S21 - Safety Guideline for Worker Protection
SEMI S21 - Safety Guideline for Worker Protection Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
T01600 - SEMI T16 - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks
SEMI T16 - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
PV01300 - SEMI PV13 - 渦電流センサを用いたシリコンウェーハ，インゴット，およびブリックの過剰電荷キャリア再結合ライフタイムの非接触測定に関する試験方法
SEMI PV13 - 渦電流センサを用いたシリコンウェーハ，インゴット，およびブリックの過剰電荷キャリア再結合ライフタイムの非接触測定に関する試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
T00500 - SEMI T5 - Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers
SEMI T5 - Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000