SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

SEMIViews - ReaderSEMIViews - Reader
SEMIViews Reader Sale priceMember Price: ₩875
Non-Member Price: ₩2,992,000
C06600 - SEMI C66 - Guide for Trimethylaluminium (TMAI), 99.5% Quality
SEMI C66 - Guide for Trimethylaluminium (TMAI), 99.5% Quality Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
D02100 - SEMI D21 - Terminology for FPD Mask Pattern Accuracy
SEMI D21 - Terminology for FPD Mask Pattern Accuracy Sale priceMember Price: ₩113
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C05000 - SEMI C50 - Guide for Trimethylphosphite
SEMI C50 - Guide for Trimethylphosphite Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
D02500 - SEMI D25 - FPDガラス基板輸送用梱包ケースの仕様
SEMI D25 - FPDガラス基板輸送用梱包ケースの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
C08300 - SEMI C83 - PFA融着継手で作られる融着接合部に加える引っ張り強度のための試験方法
SEMI C83 - PFA融着継手で作られる融着接合部に加える引っ張り強度のための試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
D04900 - SEMI D49 - Specification of Single Substrate Orientation for Loading/Unloading Into/From Equipment to Specify ID Reader Position
SEMI D49 - Specification of Single Substrate Orientation for Loading/Unloading Into/From Equipment to Specify ID Reader Position Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
C08900 - SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS)
SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS) Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
D02200 - SEMI D22 - Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies
SEMI D22 - Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
C00306 - SEMI C3.6 - シリンダ中のホスフィン（PH3），品質99.98% の仕様
SEMI C3.6 - シリンダ中のホスフィン（PH3），品質99.98% の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
3D00600 - SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration
SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
C00352 - SEMI C3.52 - Standard for Tungsten Hexafluoride, 99.996% Quality
SEMI C3.52 - Standard for Tungsten Hexafluoride, 99.996% Quality Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
C00328 - SEMI C3.28 - Standard for Nitrogen (N2), VLSI Grade in Cylinders, 99.9996% Quality
SEMI C3.28 - Standard for Nitrogen (N2), VLSI Grade in Cylinders, 99.9996% Quality Sale priceMember Price: ₩113
Non-Member Price: ₩290,000
D01200 - SEMI D12 - FPD基板のエッジ状態の仕様
SEMI D12 - FPD基板のエッジ状態の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩347,000
C00356 - SEMI C3.56 - Specification for Diborane Mixtures
SEMI C3.56 - Specification for Diborane Mixtures Sale priceMember Price: ₩113
Non-Member Price: ₩290,000