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M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD
SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F05100 - SEMI F51 - Guide for Elastometric Sealing Technology
SEMI F51 - Guide for Elastometric Sealing Technology Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M07500 - SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers
SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F04400 - SEMI F44 - Specification for Machined Stainless Steel Weld Fittings
SEMI F44 - Specification for Machined Stainless Steel Weld Fittings Sale price Member Price : ₩113
M08800 - SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods
SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M06400 - SEMI M64 - 赤外線吸収スペクトル法による絶縁（SI）ガリウムヒ素単結晶内のEL2深いドナー濃度の試験方法
SEMI M64 - 赤外線吸収スペクトル法による絶縁（SI）ガリウムヒ素単結晶内のEL2深いドナー濃度の試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M03500 - SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド
SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
F02300 - SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen
SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F04500 - SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings
SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings Sale price Member Price : ₩113
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M06100 - SEMI M61 - 埋め込み層付きシリコンエピタキシャルウェーハの仕様
SEMI M61 - 埋め込み層付きシリコンエピタキシャルウェーハの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
MF002800 - SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF180900 - SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M04000 - SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M05400 - SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド
SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M05000 - SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M01600 - SEMI M16 - 多結晶シリコンの仕様
SEMI M16 - 多結晶シリコンの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M04100 - SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様
SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
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