SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

M06800 - SEMI M68 - 測定した高さデータ配列から曲率法ZDDを使ってウェーハのエッジ近傍形状を決定するための作業方法
SEMI M68 - 測定した高さデータ配列から曲率法ZDDを使ってウェーハのエッジ近傍形状を決定するための作業方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
M06000 - SEMI M60 - シリコンウェーハ評価のためのSiO2の経時絶縁破壊特性の試験方法
SEMI M60 - シリコンウェーハ評価のためのSiO2の経時絶縁破壊特性の試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G03800 - SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD
SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
F02300 - SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen
SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M06400 - SEMI M64 - 赤外線吸収スペクトル法による絶縁（SI）ガリウムヒ素単結晶内のEL2深いドナー濃度の試験方法
SEMI M64 - 赤外線吸収スペクトル法による絶縁（SI）ガリウムヒ素単結晶内のEL2深いドナー濃度の試験方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
F07800 - SEMI F78 - Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications
SEMI F78 - Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
M07500 - SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers
SEMI M75 - Specification for Polished Monocrystalline Gallium Antimonide Wafers Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M03500 - SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド
SEMI M35 - 自動検査により検出されるシリコンウェーハ表面特性の仕様を開発するためのガイド Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
F04400 - SEMI F44 - Specification for Machined Stainless Steel Weld Fittings
SEMI F44 - Specification for Machined Stainless Steel Weld Fittings Sale price Member Price : ₩113
G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様
SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M05400 - SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド
SEMI M54 - 半絶縁性（SI）GaAs材料のパラメータのガイド Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF180900 - SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M00100 - SEMI M1 - Specification for Polished Single Crystal Silicon Wafers
SEMI M1 - Specification for Polished Single Crystal Silicon Wafers Sale priceMember Price: ₩225
Non-Member Price: ₩572,000
M01600 - SEMI M16 - 多結晶シリコンの仕様
SEMI M16 - 多結晶シリコンの仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
M04100 - SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様
SEMI M41 - 電源デバイス／IC用シリコン・オン・インシュレーター（SOI）の仕様 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: ₩135
Non-Member Price: ₩348,000
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G08100 - SEMI G81 - Specification for Map Data Items
SEMI G81 - Specification for Map Data Items Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
G04900 - SEMI G49 - Specification for Plastic Molding Preforms
SEMI G49 - Specification for Plastic Molding Preforms Sale priceMember Price: ₩113
Non-Member Price: ₩291,000
MF213900 - SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry Sale priceMember Price: ₩113
Non-Member Price: ₩291,000