{"product_id":"semi108-fhe-for-medical-industrial-applications","title":"SEMI108 FHE for Medical \u0026 Industrial Applications","description":"This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products.  Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.\u003cbr\u003e\u003cbr\u003eThis course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.  \u003cbr\u003e\u003cbr\u003eCourse Outline\u003cul\u003e\n\u003cli\u003eFlexible hybrid electronics:  definition, design, and fabrication\u003c\/li\u003e\n\u003cli\u003eChallenges to interface hard and soft electronic components\u003c\/li\u003e\n\u003cli\u003eIntroduction to the IEEE Heterogeneous Integration Roadmap (HIR)\u003c\/li\u003e\n\u003cli\u003eOverview of inks and encapsulants\u003c\/li\u003e\n\u003cli\u003ePrinting methods: dispense, inkjet, screen printing, multi-axis aerosol jet printing\u003c\/li\u003e\n\u003cli\u003eElectromechanical evaluation of printed interconnects\u003c\/li\u003e\n\u003cli\u003eAdditive manufacturing of resistors and capacitors\u003c\/li\u003e\n\u003cli\u003eHighly stretchable conductors\u003c\/li\u003e\n\u003cli\u003eInterconnecting in the z direction - printed vias\u003c\/li\u003e\n\u003cli\u003ePrinted RF devices and antennas\u003c\/li\u003e\n\u003cli\u003eDevice and component placement and assembly\u003c\/li\u003e\n\u003cli\u003eThinned semiconductor devices\u003c\/li\u003e\n\u003cli\u003eApproaches to bond devices and components to flexible substrates\u003c\/li\u003e\n\u003cli\u003eConcepts of operation and evaluation of performance and reliability\u003c\/li\u003e\n\u003cli\u003eApplications to medical and industrial sensors will be incorporated throughout\u003c\/li\u003e\n\u003c\/ul\u003e\u003cbr\u003eInstructor:  Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton.  He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex.  He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. \u003cbr\u003e\u003cbr\u003eHis research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics.  He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. ","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234403135555,"sku":"15938","price":7500.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI108a.jpg?v=1776701332","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/semi108-fhe-for-medical-industrial-applications","provider":"SEMI Dev 2","version":"1.0","type":"link"}