{"product_id":"semi103-hybrid-integration-techniques-for-flexible-electronics","title":"SEMI103 Hybrid Integration Techniques for Flexible Electronics","description":"\u003cp\u003eT\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eThis course describes techniques practiced at Palo Alto Research Center for fabricating flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits, and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates and also the development of electronics on textiles. \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Objectives \u003c\/strong\u003e \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDescribes the techniques and practices at the Palo Alto Research Center (PARC) for fabricating flexible hybrid electronics.\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain logic circuits and resistors.\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain how to bond integrated circuits.\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003cli style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDescribes how to integrate sensors of different types on flexible substrates without degradation.\u003c\/i\u003e\u003c\/em\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e60 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eManagers, supervisors, engineers, technicians or any individual working directly with this equipment or product  \u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e \u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-bottom:0px;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge \u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\u003cp style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(65, 65, 65);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;line-height:normal;margin-top:0px;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eNone\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234402381891,"sku":"15933","price":7500.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/SEMI103a.jpg?v=1776701326","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/semi103-hybrid-integration-techniques-for-flexible-electronics","provider":"SEMI Dev 2","version":"1.0","type":"link"}