{"product_id":"ms01200-semi-ms12-specification-for-silicon-substrates-used-in-fabrication-of-mems-devices","title":"MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e1  Purpose\u003cbr\u003e1.1  Although the substrates used in the production of MEMS share many physical and electrical properties with those used in IC manufacturing there are some significant differences as well. There exists a need to standardize MEMS substrates to allow the stocking of standard material, lowering the time to purchase, time to market and overall cost. This specification provides the necessary information for ordering and specifying such substrates.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Standard can be used as a basic purchasing template between the substrate buyer and seller of 150 mm and 200 mm nominal diameter substrates.\u003cbr\u003e2.2  This Standard contains the information needed to specify selected categories of substrates used in MEMS manufacturing including information on physical properties such as dimensions and surface properties as well as basic electrical properties.\u003cbr\u003e2.3  The values for characteristics, which have been historically agreed upon between supplier and user are listed in tabular form in this Specification. Where values have not been historically agreed upon, the property has been listed with a value to be specified between the buyer and seller.\u003cbr\u003e2.4  One or more methods for measurements used to determine the tabulated characteristics are included where practical.\u003cbr\u003e\u003cstrong\u003eNOTICE:\u003c\/strong\u003e SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards \u003c\/strong\u003e(purchase separately)\u003cbr\u003eSEMI 3D4 — Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp\/Sori, and Flatness of Bonded Wafer Stacks\u003cbr\u003eSEMI 3D13 — Guide for Measuring Voids in Bonded Wafer Stacks\u003cbr\u003eSEMI M1 — Specification for Polished Single Crystal Silicon Wafers\u003cbr\u003eSEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers\u003cbr\u003eSEMI M13 — Specification for Alphanumeric Marking of Silicon Wafers\u003cbr\u003eSEMI MF533 — Test Method for Thickness and Thickness Variations of Silicon Wafers\u003cbr\u003eSEMI MF534 — Test Method for Bow of Silicon Wafers\u003cbr\u003eSEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates\u003cbr\u003eSEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning\u003cbr\u003e\u003cstrong\u003eNOTICE:\u003c\/strong\u003e Unless otherwise indicated, all documents cited shall be the latest published versions.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI MS12-0220 (Reapproved 1125)\u003cbr\u003eSEMI MS12-0220 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI MS12-0220 (Reapproved 1125) - Current","offer_id":43106866823235,"sku":"18830","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MS12-0220 - Superseded","offer_id":43106866856003,"sku":"13766","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/MSVolume_fb5f5577-3b91-4423-85b6-fcf892108ad7.png?v=1776701779","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/ms01200-semi-ms12-specification-for-silicon-substrates-used-in-fabrication-of-mems-devices","provider":"SEMI Dev 2","version":"1.0","type":"link"}