{"product_id":"mf153000-semi-mf1530-test-method-for-measuring-flatness-thickness-and-total-thickness-variation-on-silicon-wafers-by-automated-noncontact-scanning","title":"MF153000 - SEMI MF1530 - Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e1  Purpose\u003cbr\u003e1.1  Flatness, thickness and thickness variation are vital factors affecting the yield of semiconductor device processing.\u003cbr\u003e1.2  Knowledge of these characteristics can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements.\u003cbr\u003e1.3  This Test Method is suitable for measuring the flatness and thickness of wafers used in semiconductor device processing in the as-sliced, lapped, etched, polished, epitaxial or other layer condition.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Test Method covers a noncontacting, nondestructive procedure to determine the thickness and flatness of clean, dry, semiconductor wafers in such a way that no physical reference is required.\u003cbr\u003e2.2  This Test Method is applicable to wafers 50 mm or larger in diameter, and 100 µm (0.004 in.) approximately and larger in thickness, independent of thickness variation and surface finish, and of wafer shape.\u003cbr\u003e2.3  This Test Method measures the flatness of the front wafer surface as it would appear relative to a specified reference plane when the back surface of the water is ideally flat, as when pulled down onto an ideally clean, flat chuck. It does not measure the free-form shape of the wafer.\u003cbr\u003e2.4  Because no chuck is used as a measurement reference, this Test Method is relatively insensitive to microscopic particles on the back surface of the wafer.\u003cbr\u003e2.5  The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003cbr\u003eSEMI M1 — Specification for Polished Single Crystal Silicon Wafers\u003cbr\u003eSEMI M20 — Practice for Establishing a Wafer Coordinate System\u003cbr\u003eSEMI M59 — Terminology for Silicon Technology\u003cbr\u003eSEMI MF1390 — Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI MF1530-0707 (Reapproved 0824)\u003cbr\u003eSEMI MF1530-0707 (Reapproved 1018)\u003cbr\u003eSEMI MF1530-0707 (Reapproved 0512)\u003cbr\u003eSEMI MF1530-0707 (technical revision)\u003cbr\u003eSEMI MF1530-1105 (technical revision)\u003cbr\u003eSEMI MF1530-1104 (technical revision)\u003cbr\u003eSEMI MF1530-0704 (technical revision)\u003cbr\u003eSEMI MF1530-02 (first SEMI publication)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI MF1530-0707 (Reapproved 0824) - Current","offer_id":43106889269315,"sku":"17982","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1530-0707 (Reapproved 1018) - Superseded","offer_id":43106889302083,"sku":"4933","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1530-0707 (Reapproved 0512) - Superseded","offer_id":40234307649603,"sku":"9857","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1530-0707 - Superseded","offer_id":40234307715139,"sku":"9856","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1530-1105 - Superseded","offer_id":40234307747907,"sku":"9859","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1530-1104 - Superseded","offer_id":40234307780675,"sku":"9858","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1530-0704 - Superseded","offer_id":40234307878979,"sku":"9855","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/MFVolume_8e0cf026-fb1d-4754-855b-efa063abf6b3.png?v=1776702543","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/mf153000-semi-mf1530-test-method-for-measuring-flatness-thickness-and-total-thickness-variation-on-silicon-wafers-by-automated-noncontact-scanning","provider":"SEMI Dev 2","version":"1.0","type":"link"}