{"product_id":"mf139000-semi-mf1390-test-method-for-measuring-bow-and-warp-on-silicon-wafers-by-automated-noncontact-scanning","title":"MF139000 - SEMI MF1390 - Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning","description":"\u003cp style=\"text-align:justify;\" dir=\"ltr\"\u003e \u003c\/p\u003e\u003cp\u003eThis Test Method is suitable for measuring the bow and warp of wafers used in semiconductor device processing in the as-sliced, lapped, etched, polished, epitaxial or other layer condition and for monitoring thermal and mechanical effects on the bow and warp of wafers during device processing.\u003c\/p\u003e\u003cp\u003e\u003cbr\u003eThis Test Method covers a noncontacting, nondestructive procedure to determine the bow and warp of clean, dry semiconductor wafers.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Test Method employs a two-probe system that examines both external surfaces of the wafer simultaneously.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThe Test Method is applicable to wafers 50 mm or larger in diameter, and approximately 100 µm and larger in thickness, independent of thickness variation and surface finish, and of gravitationally induced wafer distortion.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Test Method is not intended to measure the flatness of either exposed silicon surface. Bow and warp are measures of the distortion of the median surface of the wafer.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Test Method measures bow and warp of a wafer corrected for mechanical forces applied during the test. Therefore, the procedure described gives the unconstrained value of bow and warp.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Test Method includes several methods for canceling gravity-induced deflection which could otherwise alter the shape of the wafer.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003cbr\u003eSEMI M1 — Specification for Polished Single Crystal Silicon Wafers\u003cbr\u003eSEMI M20 — Practice for Establishing a Wafer Coordinate System\u003cbr\u003eSEMI M59 — Terminology for Silicon Technology\u003cbr\u003eSEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI MF1390-0218 (Reapproved 1023)\u003cbr\u003eSEMI MF1390-0218 (technical revision)\u003cbr\u003eSEMI MF1390-1014 (technical revision)\u003cbr\u003eSEMI MF1390-0707 (Reapproved 0512)\u003cbr\u003eSEMI MF1390-0707 (technical revision)\u003cbr\u003eSEMI MF1390-1104 (technical revision)\u003cbr\u003eSEMI MF1390-0704 (technical revision)\u003cbr\u003eSEMI MF1390-02 (first SEMI publication)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI MF1390-0218 (Reapproved 1023) - Current","offer_id":43106889662531,"sku":"17174","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-0218 - Superseded","offer_id":43106889695299,"sku":"4926","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-1014 - Superseded","offer_id":40234308862019,"sku":"9830","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-0707 (Reapproved 0512) - Superseded","offer_id":40234308927555,"sku":"9829","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-0707 - Superseded","offer_id":40234309058627,"sku":"9828","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-1104 - Superseded","offer_id":40234309156931,"sku":"9831","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-0704 - Superseded","offer_id":40234309222467,"sku":"9827","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI MF1390-02 - Superseded","offer_id":40234309288003,"sku":"9826","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/MFVolume_b9517028-5f2e-4436-91ca-7116290fefbd.png?v=1776702554","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/mf139000-semi-mf1390-test-method-for-measuring-bow-and-warp-on-silicon-wafers-by-automated-noncontact-scanning","provider":"SEMI Dev 2","version":"1.0","type":"link"}