{"product_id":"m05200-semi-m52-guide-for-specifying-scanning-surface-inspection-systems-for-silicon-wafers-for-the-130-nm-to-11-nm-technology-generations","title":"M05200 - SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version.\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e1  Purpose\u003cbr\u003e1.1  This Guide provides recommendations for specifying scanning surface inspection systems (SSIS) for the 130, 90, 65, 45, 32, 22, 16, 11, 7, and 5 nm technology generations. The number and size of localized light scatterers (LLS) on silicon wafers are specified by customers of silicon wafer suppliers and are usually part of Certificates of Compliance. Suppliers of silicon wafers and their customers might measure these parameters using measurement systems provided by different manufacturers of such systems or using different generations of measurement systems from one supplier. Therefore, standardization of various aspects of such measurement systems both improves data exchange and data interpretation and aids in procurement of appropriate measurement systems.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Guide outlines and recommends basic specifications for SSIS equipment used for the 130, 90, 65, 45, 32, 22, 16, 11, 7, and 5 nm technology generations. Recommendations for the 130 to 11 nm generations are unchanged from previous versions of this Guide. The 7 and 5 nm node characteristics are taken from the 2018 edition of the International Roadmap for Devices and Systems (IRDS) , the successor to the International Technology Roadmap for Semiconductors (ITRS).\u003cbr\u003e2.2  The Guide covers generic equipment characteristics of (Table 1), materials to be measured by (Table 2), and metrology specific equipment characteristics of (Table 3) measurement systems used for verifying the quality parameter LLS counts per wafer in large scale production of bare polished or epitaxial surfaces of silicon wafers, the back surface of which may be polished or acid etched, either bare or covered by an unpatterned, homogeneous layer of polysilicon or low temperature oxide (LTO). Reference materials for calibrating measurement systems might have different properties.\u003cbr\u003e2.3  The Guide also applies to measurement systems that provide only a subset of the measurement features outlined in Table 3.\u003cbr\u003e2.4  This Guide does not apply to measurement systems used to control intermediate process steps during silicon wafer manufacturing. However, it may be completely or partly used for measurement systems for those applications provided corresponding constraints are appropriately identified.\u003cbr\u003e2.5  This Guide does not apply to measurement systems for silicon on insulator (SOI) wafers or patterned wafers.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards \u003c\/strong\u003e(purchase separately)\u003cbr\u003eSEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers\u003cbr\u003eSEMI E5 — Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II)\u003cbr\u003eSEMI E10 — Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization\u003cbr\u003eSEMI E19 — Specification for Standard Mechanical Interface (SMIF)\u003cbr\u003eSEMI E30 — Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)\u003cbr\u003eSEMI E37 — Specification for High Speed SECS Message Services (HSMS) Generic Services\u003cbr\u003eSEMI E47 — Specification for 150 mm\/200 mm Pod Handles\u003cbr\u003eSEMI E47.1 — Mechanical Specification for FOUPs Used to Transport and Store 300 mm Wafers\u003cbr\u003eSEMI E58 — Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and Services\u003cbr\u003eSEMI E89 — Guide for Measurement System Analysis (MSA)\u003cbr\u003eSEMI E158 — Specification for Mechanical Features of Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling\u003cbr\u003eSEMI E159 — Specification for Mechanical Features of Multi Application Carrier (MAC) Used to Transport and Ship 450 mm Wafers\u003cbr\u003eSEMI M1 — Specification for Polished Single Crystal Silicon Wafers\u003cbr\u003eSEMI M31 — Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers\u003cbr\u003eSEMI M33 — Test Method for the Determination of Residual Surface Contamination on Silicon Wafers by Means of Total Reflection X-Ray Fluorescence Spectroscopy (TXRF)\u003cbr\u003eSEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection\u003cbr\u003eSEMI M38 — Specification for Polished Reclaimed Silicon Wafers\u003cbr\u003eSEMI M50 — Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method\u003cbr\u003eSEMI M53 — Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodisperse Polystyrene Latex Sphere on Unpatterned Semiconductor Wafer Surfaces\u003cbr\u003eSEMI M58 — Test Method for Evaluating DMA Based Particle Deposition Systems and Processes\u003cbr\u003eSEMI M59 — Terminology for Silicon Technology\u003cbr\u003eSEMI M80 — Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI M52-0525 (technical revision)\u003cbr\u003eSEMI M52-0923 (technical revision)\u003cbr\u003eSEMI M52-0621 (technical revision)\u003cbr\u003eSEMI M52-0214 (technical revision)\u003cbr\u003eSEMI M52-0912 (technical revision)\u003cbr\u003eSEMI M52-0412 (technical revision)\u003cbr\u003eSEMI M52-0307 (technical revision)\u003cbr\u003eSEMI M52-0706E (editorial revision)\u003cbr\u003eSEMI M52-0706 (complete rewrite)\u003cbr\u003eSEMI M52-0703 (technical revision)\u003cbr\u003eSEMI M52-0303 (technical revision)\u003cbr\u003eSEMI M52-1102 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI M52-0525 - 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