{"product_id":"g10100-semi-g101-specification-for-modulus-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packaging","title":"G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging","description":"\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe characteristics of encapsulation materials such as modulus needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis Specification focuses on the modulus of encapsulation material used in the manufacturing of WLP and PLP processes.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis methodology is defined by 3-point bend test method to measure modulus.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eSEMI G83 — Specification for Bar Code Marking of Product Packages\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eRevision History\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/b\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eSEMI G101-1122 (first published)\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e","brand":"semi.org","offers":[{"title":"SEMI G101-1122 - Current","offer_id":40348632514627,"sku":"16275","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_afe95f3a-1d54-4a8e-9ef7-bdc35a2f6659.png?v=1776701293","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g10100-semi-g101-specification-for-modulus-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packaging","provider":"SEMI Dev 2","version":"1.0","type":"link"}