{"product_id":"g10000-semi-g100-specification-for-gel-time-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packaging","title":"G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging","description":"\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these materials require the different characteristics and performances.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe characteristics of encapsulation materials such as gel time needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis Specification focuses on the gel time of encapsulation material used in the manufacturing of WLP and PLP processes.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis methodology is defined to measure the gel time by torque meter method.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eSEMI G83 — Specification for Bar Code Marking of Product Packages\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eRevision History\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/b\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eSEMI G100-1122 (first published)\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e","brand":"semi.org","offers":[{"title":"SEMI G100-1122 - Current","offer_id":40348632580163,"sku":"16273","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_ab83b35e-672c-4f8e-b747-0bb092740757.png?v=1776701294","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g10000-semi-g100-specification-for-gel-time-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packaging","provider":"SEMI Dev 2","version":"1.0","type":"link"}