{"product_id":"g09600-semi-g96-test-method-for-measurement-of-chip-die-strength-by-mean-of-cantilever-bending","title":"G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version.\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e1  Purpose\u003cbr\u003e1.1  This Test Method defines a procedure for evaluation of die strength by mean of cantilever bending where 3 point bending is not easy to measure strength in case of wafer thickness less than 50 µm.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Test Method applies only for cantilever bending method, and other methods will be defined by separate documents.\u003cbr\u003e2.2  This Test Method is used to measure die strength for dies from processed wafers.\u003cbr\u003e2.3  Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and certification. This Standard extends to the region of ultra-thin thickness from 3 point bending measurement method SEMI G86-0303 which describes the Die Strength Evaluation Method, Measurement Data Summary Technique and Data Usage for Test Report.\u003cbr\u003eNOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003cbr\u003eSEMI G86 — Test Method for Measurement of Chip (Die) Strength by Mean of 3 Point Bending\u003cbr\u003eNOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI G96-0126 (technical revision)\u003cbr\u003eSEMI G96-1014 (Reapproved 1019)\u003cbr\u003eSEMI G96-1014 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G96-0126 - Current","offer_id":43106894544963,"sku":"18912","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G96-0126 - Current + Redline","offer_id":43106894577731,"sku":"18913","price":38900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G96-1014 (Reapproved 1019) - Superseded","offer_id":43106894610499,"sku":"13597","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G96-1014 - Superseded","offer_id":40234296180803,"sku":"4272","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_15513707-7bda-460b-86ef-30496129edd4.png?v=1776702676","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g09600-semi-g96-test-method-for-measurement-of-chip-die-strength-by-mean-of-cantilever-bending","provider":"SEMI Dev 2","version":"1.0","type":"link"}