{"product_id":"g08600-semi-g86-test-method-for-measurement-of-chip-die-strength-by-mean-of-3-point-bending","title":"G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending","description":"\u003cp align=\"justify\" dir=\"ltr\"\u003e　\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003eThis Test Method defines a procedure for the evaluation of die strength by the mean of 3-point bending method.\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003e \u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003eThis Test Method applies only for 3-point bending method, and other methods will be defined by the separate documents.\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003e　\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003eThis Test Method is used to measure die strength for dies from processed wafers.\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003e　\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003eWafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and certification. This Standard is one of the documents, which describe the Die Strength Evaluation Method, Measurement Data Summary Technique and Data Usage for Test Report.\u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003e \u003c\/p\u003e\u003cp align=\"justify\" dir=\"ltr\"\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/p\u003e\u003cp\u003eNone.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eRevision History\u003c\/b\u003e\u003cbr\u003eSEMI G86-0217 (Reapproved 1122)\u003cbr\u003eSEMI G86-0217 (technical revision)\u003cbr\u003eSEMI G86-0303 (Reapproved 0811)\u003cbr\u003eSEMI G86-0303 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G86-0217 (Reapproved 1122) - Current","offer_id":40348666134595,"sku":"16265","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G86-0217 - Superseded","offer_id":40348666167363,"sku":"4282","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G86-0303 (Reapproved 0811) - Superseded","offer_id":40234285695043,"sku":"12282","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G86-0303 - Superseded","offer_id":40234285793347,"sku":"12305","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_d99d0efd-d192-4a14-af9e-6f738549559a.png?v=1776702668","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g08600-semi-g86-test-method-for-measurement-of-chip-die-strength-by-mean-of-3-point-bending","provider":"SEMI Dev 2","version":"1.0","type":"link"}