{"product_id":"g06900-semi-g69-test-method-for-measurement-of-adhesive-strength-between-leadframes-and-molding-compounds","title":"G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eThis Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eThe procedures include shear test, pull test, and three-point bending techniques.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eThis Standard may be used on all types of semiconductor leadframe and molding compound.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eThe methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a guideline.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eThe methods in this Standard use SI units.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eNone.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eSEMI G69-0996 (Reapproved 0823)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eSEMI G69-0996 (Reapproved 0318)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eSEMI G69-0996 (Reapproved 0811)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eSEMI G69-0996 (Reapproved 1104)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;'\u003eSEMI G69-0996 (first published)\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G69-0996 (Reapproved 0823) - Current","offer_id":43106894086211,"sku":"17073","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G69-0996 (Reapproved 0318) - Superseded","offer_id":43106894118979,"sku":"4300","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G69-0996 (Reapproved 0811) - Superseded","offer_id":40234298277955,"sku":"12319","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G69-0996 (Reapproved 1104) - Superseded","offer_id":40234298310723,"sku":"12241","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_451bb8fb-c042-4a39-a5e7-08e1b2f86ec3.png?v=1776702654","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g06900-semi-g69-test-method-for-measurement-of-adhesive-strength-between-leadframes-and-molding-compounds","provider":"SEMI Dev 2","version":"1.0","type":"link"}