{"product_id":"g05400-semi-g54-specification-for-dimensions-and-tolerances-used-to-manufacture-molded-plastic-packages","title":"G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages","description":"This document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC-registered outlines: Plastic Dual-in-Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I.C. Packages (SOIC - Gull Wing and \"J\" lead); and Plastic TAB Quad Packages (PTAB)Title.\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eSEMI G48 — Specification, Measurement Method for Molded Plastic Package Tooling\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234374856771,"sku":"","price":24800.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_f46b9282-9774-4ea7-955a-81fb959ef4db.png?v=1776701814","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g05400-semi-g54-specification-for-dimensions-and-tolerances-used-to-manufacture-molded-plastic-packages","provider":"SEMI Dev 2","version":"1.0","type":"link"}