{"product_id":"g04800-semi-g48-specification-for-measurement-method-for-molded-plastic-package-tooling","title":"G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling","description":"This document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i.e., DIPS, SIPS, PCC, SO, Quad, and TAB).\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eSEMI G14 — Plastic Molded DIP Tooling \u003cbr\u003e SEMI G16 — Plastic Chip Carrier Tooling \u003cbr\u003e SEMI G36 — Plastic Molded High Density TAB Quad Tooling \u003cbr\u003e SEMI G37 — Plastic Molded SO Package Tooling\u003cbr\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234372956227,"sku":"","price":24800.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_c1922fb7-30ff-4ad6-a29c-ba090e9bf584.png?v=1776701816","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g04800-semi-g48-specification-for-measurement-method-for-molded-plastic-package-tooling","provider":"SEMI Dev 2","version":"1.0","type":"link"}