{"product_id":"g04500-semi-g45-recommended-practice-for-flash-characteristics-of-thermosetting-molding-compounds","title":"G04500 - SEMI G45 - Practice for Flash Characteristics of Thermosetting Molding Compounds","description":"\u003cp class=\"StdsH2\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis\nspecification defines a procedure for measuring the flashing characteristics of\nsemiconductor grade transfer molding compounds.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\n\n\u003cp class=\"StdsH3\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e \u003c\/span\u003e\u003c\/p\u003e\n\n\u003cp class=\"StdsH3\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe\nflashing tendency for semiconductor grade molding compounds depends on the\ninteraction of several variables, including mold conditions, process\nparameters, molding compound viscosity, and curing characteristics. This test\nis not a valid method for predicting the flashing performance in all mold\ntypes. It is a method for comparing flash tendency and flashing type of different\nmolding compounds when evaluated under a specific set of molding process\nparameters.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\n\n\u003cp class=\"StdsH3\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e \u003c\/span\u003e\u003c\/p\u003e\n\n\u003cp class=\"StdsH3\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eFlashing\npresents problems with subsequent processing of plastic packaged devices after\nmolding. A high flashing tendency increases die wear in the trim and form operation,\nmay interfere with plating or solder dip finishing operations, and may prevent\ngood contact for electrical test. Thus, reduced tendency toward flashing will\nimprove the plastic package subassembly operations. The information from this\ntest will be of value in rating flash performance of any given compound to that\nin production use.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\n\n\u003cbr\u003e\n\n\u003cp class=\"StdsH2\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe\nspecification and test methods details in this Document apply to mold resin\ncompounds which is used for packaging.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp dir=\"ltr\" align=\"justify\"\u003e\u003cfont face=\"arial\"\u003e　\u003c\/font\u003e\u003c\/p\u003e\u003cfont face=\"arial\"\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003c\/font\u003e\u003cp\u003e\u003cfont face=\"arial\"\u003eNone.\u003c\/font\u003e\u003cbr\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G45-0519 - Inactive","offer_id":43106895265859,"sku":"8804","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G45-93 - Superseded","offer_id":40234289397827,"sku":"4234","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_6bf4093c-1ebc-45d6-a0da-5663d19af888.png?v=1776702702","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g04500-semi-g45-recommended-practice-for-flash-characteristics-of-thermosetting-molding-compounds","provider":"SEMI Dev 2","version":"1.0","type":"link"}