{"product_id":"g04400-semi-g44-lead-finishes-for-glass-to-metal-seal-ceramic-packages-active-devices-only","title":"G04400 - SEMI G44 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)","description":"\u003cp dir=\"ltr\" align=\"justify\"\u003e\u003cfont size=\"2\" face=\"Microsoft Sans Serif\"\u003eThis specification defines lead finishes for glass to metal seal ceramic packages assembled with iron-nickel alloy leadframe construction. It defines composition, properties, limits, and refers to appropriate tests for utility.\u003c\/font\u003e\u003c\/p\u003e \u003cp dir=\"ltr\" align=\"justify\"\u003e\u003cfont size=\"2\" face=\"Microsoft Sans Serif\"\u003e　\u003c\/font\u003e\u003c\/p\u003e \u003cp dir=\"ltr\" align=\"justify\"\u003e\u003cfont size=\"2\" face=\"Microsoft Sans Serif\"\u003eThe criteria detailed in this document applies to glass to metal seal ceramic packages, assembled with iron-nickel alloy leadframe construction, which conforms to composition limits specified in MIL-M-38510 as lead material Type A or Type B.\u003c\/font\u003e\u003c\/p\u003e \u003cp dir=\"ltr\" align=\"left\"\u003e\u003c\/p\u003e\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eSEMI G2 — Specification Metallic Leadframes for Cer-DIP Packages \u003cbr\u003e SEMI G35 — Specification Test Methods for Lead Finishes on Semiconductor (Active Devices) \u003cbr\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G44-86 - Superseded","offer_id":40234367418435,"sku":"12332","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_99b8570a-f883-4575-8fda-a8214e06469e.png?v=1776701883","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g04400-semi-g44-lead-finishes-for-glass-to-metal-seal-ceramic-packages-active-devices-only","provider":"SEMI Dev 2","version":"1.0","type":"link"}