{"product_id":"g04300-semi-g43-test-method-for-junction-to-case-thermal-resistance-measurements-of-molded-plastic-packages","title":"G04300 - SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages","description":"\u003cp class=\"StdsH2\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe\npurpose of this test is to determine the thermal resistance of molded plastic\npackages using thermal test chips. This Test Method deals only with\njunction-to-case measurements of thermal resistance and limits itself to fluid\nbath testing environments. For this test, conduction through the leads is\nminimized, thus providing information on the ability of the plastic package\nmaterial to dissipate heat.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cbr\u003e\u003cp class=\"StdsIndent\" style=\"MARGIN: 0in 0.5in 6pt\"\u003e\n\n\n\n\u003c\/p\u003e\u003cp class=\"StdsH2\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis\nTest Method should only be used for comparing the thermal characteristics of\nplastic packages in the same fluid bath system due to the thermophysical\nproperties of the heat transfer fluids used and the effects of the variable\nnature of the fluid-stirring and package-mounting procedures.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cfont style=\"\"\u003e\u003cfont style=\"\"\u003e\u003cfont style=\"\"\u003e \u003cp style=\"font-size: small;\"\u003e \u003cspan style=\"font-family: arial;\"\u003e　\u003c\/span\u003e\u003c\/p\u003e\n\u003cfont face=\"arial\" style=\"\"\u003e\u003cb style=\"\"\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003c\/font\u003e\u003cp style=\"\"\u003e\u003c\/p\u003e\n\u003cp class=\"StdsText\" style=\"\"\u003e\u003cspan style=\"\" arial=\"\"\u003e\u003cfont style=\"\"\u003e\u003cfont style=\"\"\u003e\u003cfont face=\"arial\" style=\"\"\u003eSEMI G32 — Guideline for Unencapsulated Thermal Test Chip\u003c\/font\u003e\u003c!--?xml:namespace prefix = o ns = urn:schemas-microsoft-com:office:office \/--\u003e\u003cfont size=\"2\"\u003e\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003cbr\u003e\u003c\/font\u003e\u003c\/font\u003e\u003c\/span\u003e\u003c\/p\u003e\u003c\/font\u003e\u003c\/font\u003e\u003c\/font\u003e","brand":"semi.org","offers":[{"title":"SEMI G43-0519 - Inactive","offer_id":43106895233091,"sku":"8813","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G43-87 (Reapproved 0811) - Superseded","offer_id":40234296574019,"sku":"4240","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G43-87 - Superseded","offer_id":40234296737859,"sku":"12239","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_2564494c-6eb8-4167-9ee9-6ce0e4c591a0.png?v=1776702697","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g04300-semi-g43-test-method-for-junction-to-case-thermal-resistance-measurements-of-molded-plastic-packages","provider":"SEMI Dev 2","version":"1.0","type":"link"}