{"product_id":"g03700-semi-g37-specification-for-dimensions-and-tolerances-used-to-manufacture-plastic-molded-small-outline-package-tooling","title":"G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling","description":"This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end-of-line toolmakers as the basis for defining the limits of manufacturing tolerances.\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eNone.\u003cbr\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234376364099,"sku":"","price":24800.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_34d8d632-bd09-4219-b07b-0e0d6d431a4f.png?v=1776701824","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g03700-semi-g37-specification-for-dimensions-and-tolerances-used-to-manufacture-plastic-molded-small-outline-package-tooling","provider":"SEMI Dev 2","version":"1.0","type":"link"}