{"product_id":"g03500-semi-g35-specification-for-test-methods-for-lead-finishes-on-semiconductor-active-devices","title":"G03500 - SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices","description":"This specification establishes uniform methods and procedures for conducting tests on lead finishes on (active device) electronic packages. Other SEMI Standards establish materials used and the finishes for them.\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eSEMI G4 — Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes \u003cbr\u003e SEMI G18 — Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes \u003cbr\u003e SEMI G20 — Lead Finishes for Plastic Packages (Active Devices Only)\u003cbr\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234368860227,"sku":"","price":24800.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_ed3b5ff2-56e7-42a6-8b4b-6a16f599054c.png?v=1776701826","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g03500-semi-g35-specification-for-test-methods-for-lead-finishes-on-semiconductor-active-devices","provider":"SEMI Dev 2","version":"1.0","type":"link"}