{"product_id":"g02800-semi-g28-specification-for-leadframes-for-plastic-molded-s-o-packages","title":"G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages","description":"\u003cp class=\"StdsIndent\" style=\"MARGIN: 0in 0.5in 6pt\"\u003e\u003cspan style=\"FONT-SIZE: 10pt; FONT-FAMILY: Arial\"\u003eThis Standard was technically approved by the global Assembly \u0026amp; Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1986; previously published September 1997.\u003c?xml:namespace prefix = o ns = \"urn:schemas-microsoft-com:office:office\" \/\u003e\u003co:p\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e \u003cp class=\"StdsHead2\" style=\"MARGIN: 6pt 0in; mso-list: none\"\u003e\u003cspan style=\"FONT-FAMILY: Arial\"\u003e\u003co:p\u003e\u003cfont size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e \u003cp class=\"StdsHead2\" style=\"MARGIN: 6pt 0in; mso-list: none\"\u003e\u003cspan style=\"FONT-FAMILY: Arial\"\u003e\u003cfont size=\"2\"\u003eThis Specification defines the acceptance criteria for stamped leadframes for plastic molded S.O. packages.\u003c\/font\u003e\u003c\/span\u003e\u003c\/p\u003e \u003cp\u003e \u003c\/p\u003e\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cfonthelv\u003e\u003cfonthelv\u003e \u003cp dir=\"ltr\"\u003e\u003cfont\u003eSEMI G4 — Specification for Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes\u003cbr\u003e \u003cp dir=\"ltr\"\u003e\u003cfont\u003eSEMI G9 — Specification for Stamped Leadframes for Plastic Molded Dual-In-Line Semiconductor Packages\u003cbr\u003e \u003cp dir=\"ltr\"\u003e\u003cfont\u003eSEMI G10 — Standard Method for Mechanical Measurement for Plastic Package Leadframes\u003cbr\u003e \u003cp dir=\"ltr\"\u003e\u003cfont\u003eSEMI G21 — Specification for Plating Integrated Circuit Leadframes\u003cbr\u003e\u003c\/font\u003e\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\u003c\/font\u003e\u003c\/p\u003e\u003c\/fonthelv\u003e\u003c\/fonthelv\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G28-0997 (Reapproved 0811) - Inactive","offer_id":40234291527747,"sku":"4238","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G28-0997 - Superseded","offer_id":40234291626051,"sku":"12234","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_52be2921-8874-48b7-984c-7de4bf14ee44.png?v=1776702699","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g02800-semi-g28-specification-for-leadframes-for-plastic-molded-s-o-packages","provider":"SEMI Dev 2","version":"1.0","type":"link"}