{"product_id":"g02600-semi-g26-specification-for-hermetic-slam-chip-carrier-lids","title":"G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids","description":"This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0.050\" pad centerline. The SLAM package is covered separately in SEMI G5.\u003cp dir=\"ltr\" align=\"justify\"\u003e　\u003c\/p\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eNone.\u003cbr\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"Default Title","offer_id":40234370531395,"sku":"","price":24800.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_98332c58-bbc8-438b-94bc-75f7a1c4e212.png?v=1776701836","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g02600-semi-g26-specification-for-hermetic-slam-chip-carrier-lids","provider":"SEMI Dev 2","version":"1.0","type":"link"}