{"product_id":"g01300-semi-g13-standard-test-method-for-expansion-characteristics-of-molding-compounds","title":"G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds","description":" \u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size:10pt\"\u003e\u003cspan style='font-family:\"Times New Roman\",serif'\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe thermal expansion ratio and glass transition temperature of molding compounds are the key characteristics which effects the productivity and reliability of the plastic packages. The purpose of this Test Method is to determine procedures for thermal expansions characteristics of molding compound.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:10pt\"\u003e\u003cspan style='font-family:\"Times New Roman\",serif'\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis Test Method describes the procedure for measuring the coefficient of thermal expansion (CTE) and glass transition temperature (Tg) of thermosetting molding compounds.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style='font-size:10.0pt;line-height:107%;font-family:\n\"Arial\",sans-serif'\u003e\u003co:p\u003e \u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\"\u003e\u003cspan style='font-size:10.0pt;line-height:107%;font-family:\n\"Arial\",sans-serif'\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-family: Arial, sans-serif; font-size: 10pt;\"\u003eNone.\u003c\/span\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\"\u003e\u003cspan style='font-size:10.0pt;line-height:107%;font-family:\n\"Arial\",sans-serif'\u003e\u003co:p\u003e \u003c\/o:p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\"\u003e\u003cspan style='font-size:10.0pt;line-height:107%;font-family:\n\"Arial\",sans-serif'\u003e\u003cb\u003eRevision History\u003c\/b\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-family: Arial, sans-serif; font-size: 10pt;\"\u003eSEMI G13-1122 (technical revision)\u003c\/span\u003e\u003cbr\u003e\u003cspan style='font-size:10.0pt;line-height:107%;font-family:\n\"Arial\",sans-serif'\u003eSEMI G13-88 (Reapproved 0811)\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-family: Arial, sans-serif; font-size: 10pt;\"\u003eSEMI G13-88 (technical revision)\u003c\/span\u003e\u003cbr\u003e\u003cspan style='font-size:10.0pt;line-height:107%;font-family:\n\"Arial\",sans-serif'\u003eSEMI G13-84 (technical revision)\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-family: Arial, sans-serif; font-size: 10pt;\"\u003eSEMI G13-81 (first published)\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI G13-1122 - Current","offer_id":40348666265667,"sku":"16291","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G13-88 (Reapproved 0811) - Superseded","offer_id":40348666298435,"sku":"4248","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI G13-88 - Superseded","offer_id":40234281009219,"sku":"12231","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/GVolume_4fd72cd8-fe46-43d9-8c1b-e7d101f5ab72.png?v=1776702692","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/g01300-semi-g13-standard-test-method-for-expansion-characteristics-of-molding-compounds","provider":"SEMI Dev 2","version":"1.0","type":"link"}