{"product_id":"e04900-semi-e49-guide-for-high-purity-and-ultrahigh-purity-piping-performance-subassemblies-and-final-assemblies","title":"E04900 - SEMI E49 - Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e1  Purpose\u003cbr\u003e1.1  The purpose of this overview Standard is to provide a basic set of terminology and reference documents for SEMI E49.2, SEMI E49.4, SEMI E49.5, SEMI E49.6, SEMI E49.7, SEMI E49.8 and SEMI E137.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Standard contains terminology and reference documents used in SEMI E49.2, SEMI E49.4, SEMI E49.5, SEMI E49.6, SEMI E49.7, SEMI E49.8, and SEMI E137, which will reference performance and method standards as well as recommended practices.\u003cbr\u003e2.1.1  The SEMI E49 Subordinate Standards are organized by types of piping distribution systems: gas, DI\/chemical, solvent, and by types of assembly and testing procedures: subassembly for stainless steel, subassembly for polymer and final tool assembly. Final assemblies should be tested or validated for all appropriate parameters (e.g., purity, integrity, failure rate) as specified in the applicable SEMI E49 Subordinate Standards.\u003cbr\u003e2.1.2  The piping distribution Subordinate Standards (SEMI E49.2 through SEMI E49.8) include guidelines for system design, performance, materials, and components. Purity and performance grades are described for each of the three types of distribution systems.\u003cbr\u003e2.1.3  Users should complete an overall tool cost of ownership analysis (refer to SEMI E35) to determine the optimum application of HP or UHP tool features. Key parameters should include facilities cost and installation cycle time, piping system reliability and maintainability factors, tool and sub-system contribution to contamination, and resultant effects on wafer quality and wafer throughput factors.\u003cbr\u003e2.2  Final assemblies should be evaluated according to the criteria of SEMI S2 for environmental, health and safety (EH\u0026amp;S) issues associated with their use.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSubordinate Standards (included)\u003cbr\u003eSEMI E49.2 — Guide for the Qualification of Polymer Assemblies Used in Ultrapure Water and Liquid Chemical Systems in Semiconductor Process Equipment\u003cbr\u003eSEMI E49.3 — Guide for Ultrahigh Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment \u003cbr\u003eSEMI E49.4 — Guide for Ultrahigh Purity Solvent Distribution Systems with Metallic Fluid Paths in Semiconductor Manufacturing Equipment\u003cbr\u003eSEMI E49.5 — Guide for the Design of Ultrahigh Purity Solvent Distribution Systems with Non-Metallic Fluid Paths in Semiconductor Manufacturing Equipment\u003cbr\u003eSEMI E49.6 — Guide for Subsystem Assembly and Testing Procedures – Stainless Steel Systems\u003cbr\u003eSEMI E49.7 — Guide for the Design and Manufacture of Polymer Assemblies Used for Liquid Chemical Systems in Semiconductor Equipment\u003cbr\u003eSEMI E49.8 — Guide for High Purity and Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment\u003cbr\u003eSEMI E49.9 — Guide for Ultrahigh Purity Deionized Water and Chemical Distribution Systems in Semiconductor Manufacturing Equipment\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003cbr\u003eSEMI E35 — Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment\u003cbr\u003eSEMI E137 — Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment\u003cbr\u003eSEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI E49-0419 (technical revision)\u003cbr\u003eSEMI E49-0617 (designation update)\u003cbr\u003eSEMI E49-1104 (Reapproved 1211)\u003cbr\u003eSEMI E49-1104 (technical revision)\u003cbr\u003eSEMI E49-0304 (designation update)\u003cbr\u003eSEMI E49-1103 (designation update)\u003cbr\u003eSEMI E49-0702 (technical revision)\u003cbr\u003eSEMI E49-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.1-1104 - replaced by SEMI E137\u003cbr\u003eSEMI E49.1-0304 (technical revision)\u003cbr\u003eSEMI E49.1-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.2-0617 (complete rewrite)\u003cbr\u003eSEMI E49.2-1104 (technical revision)\u003cbr\u003eSEMI E49.2-0298 (technical revision)\u003cbr\u003eSEMI E49.2-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.3-0298 (Withdrawn 1104) - replaced by SEMI E49.2\u003cbr\u003eSEMI E49.3-0298 (technical revision)\u003cbr\u003eSEMI E49.3-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.4-0419 (complete rewrite)\u003cbr\u003eSEMI E49.4-0298 (technical revision)\u003cbr\u003eSEMI E49.4-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.5-0419 (complete rewrite)\u003cbr\u003eSEMI E49.5-1104 (technical revision)\u003cbr\u003eSEMI E49.5-0298 (technical revision)\u003cbr\u003eSEMI E49.5-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.6-1103 (Reapproved 1211)\u003cbr\u003eSEMI E49.6-1103 (technical revision)\u003cbr\u003eSEMI E49.6-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.7-0419 (complete rewrite)\u003cbr\u003eSEMI E49.7-0304E (editorial revision)\u003cbr\u003eSEMI E49.7-0304 (technical revision)\u003cbr\u003eSEMI E49.7-0702 (technical revision)\u003cbr\u003eSEMI E49.7-95 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.8-1103 (Reapproved 1211)\u003cbr\u003eSEMI E49.8-1103 (technical revision)\u003cbr\u003eSEMI E49.8-0298 (technical revision)\u003cbr\u003eSEMI E49.8-96 (first published)\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eSEMI E49.9-0298 (Withdrawn 0303) - replaced by SEMI E49.8 \u003cbr\u003eSEMI E49.9-0298 (technical revision)\u003cbr\u003eSEMI E49.9-96 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI E49-0419 - Current","offer_id":40234256957507,"sku":"7163","price":62700.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI E49-0617 - Superseded","offer_id":40234257023043,"sku":"3813","price":62700.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI E49-1104 (Reapproved 1211) - Superseded","offer_id":40234257055811,"sku":"7675","price":62700.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI E49-1104 - Superseded","offer_id":40234257088579,"sku":"7348","price":62700.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/EVolume_6c0725d4-ffd3-4f0c-a8ca-11f9156664da.png?v=1776702824","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/e04900-semi-e49-guide-for-high-purity-and-ultrahigh-purity-piping-performance-subassemblies-and-final-assemblies","provider":"SEMI Dev 2","version":"1.0","type":"link"}