{"product_id":"copy-of-g09900-semi-g99-specification-for-flowability-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packagingjp-demo","title":"G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging(JP Demo)","description":"\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these requires the different characteristics and performances.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThe characteristics of encapsulation materials such as flowability needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eThis Specification focuses on the flowability of encapsulation material used in the manufacturing of WLP and PLP processes.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eTwo methodologies are defined to measure the flowability by either using a Spiral Flow or a Disk Compression technique.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e- Spiral Flow can be applied to granular type of encapsulation material.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e- Disk Compression can be applied to all three types of encapsulation materials.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eSEMI G83 — Specification for Bar Code Marking of Product Packages\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eRevision History\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/b\u003e\u003cbr\u003e\u003cspan style=\"font-size:11pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style=\"font-family:Calibri,sans-serif\"\u003e\u003cspan style=\"font-size:10.0pt\"\u003e\u003cspan style=\"line-height:107%\"\u003e\u003cspan style='font-family:\"Arial\",sans-serif'\u003eSEMI G99-1122 (first published)\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e","brand":"semi.org","offers":[{"title":"SEMI G99-1122 - Current","offer_id":40543998738499,"sku":"16271","price":28100.0,"currency_code":"JPY","in_stock":true}],"url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/copy-of-g09900-semi-g99-specification-for-flowability-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packagingjp-demo","provider":"SEMI Dev 2","version":"1.0","type":"link"}