{"product_id":"c10000-semi-c100-guide-for-reporting-chemical-mechanical-planarization-cmp-polishing-pads-hardness-used-in-semiconductor-manufacturing","title":"C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing","description":"\u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThis Document will provide a \n \n guide for the measurements of and reporting of more accurate parameters of \n \n hardness of chemical mechanical planarization (CMP) pads, than current industry \n \n standards.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThis Document will provide a \n \n guide for the measurement of and reporting of effect of the temperature on the \n \n pad hardness.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eReference to this Guide can be \n \n used in the corresponding certificate of acceptance (CoA) from a CMP supplier to its customers.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eReference to this Guide can be \n \n used for generating roadmaps for the development of new semiconductor \n \n technologies.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cbr\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThis Document provides guidance \n \n on how hardness of CMP pads should be reported, for example, on a CoA.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eRelated Information 1 provides \n \n extensive background information on the following topics:\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eDetails of the test conditions \n \n to be reported on, for example, CoA for measurement of the hardness of CMP \n \n pads.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThe fundamentals for measuring \n \n pad hardness using more accurate metrologies, than the current industry process \n \n of record (POR) shore hardness (SH), or compressibility.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThe fundamentals and \n \n justification for measurements and reporting on, for example, CoA hardness at \n \n different ambient temperatures.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eList of deformation modes \n \n appropriate for the pads of different range of hardness and manufacturing \n \n styles.\u003co:p\u003e\u003c\/o:p\u003e\u003c\/font\u003e\u003c\/p\u003e \n \n  \n \n \u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e \u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003eNone.\u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e\u003cbr\u003e\u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e\u003cb\u003eRevision History\u003c\/b\u003e\u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e\u003cp class=\"MsoNormal\" style=\"margin-bottom:6.0pt\"\u003e\u003co:p\u003e\u003cfont face=\"arial\" size=\"2\"\u003eSEMI C100-1120 (first published)\u003c\/font\u003e\u003c\/o:p\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI C100-1120 - Current","offer_id":40234372563011,"sku":"14330","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/CVolume_pc_39679287-2ad4-44f1-b2fc-ba5b14f29059.png?v=1776701738","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/c10000-semi-c100-guide-for-reporting-chemical-mechanical-planarization-cmp-polishing-pads-hardness-used-in-semiconductor-manufacturing","provider":"SEMI Dev 2","version":"1.0","type":"link"}