{"product_id":"back-end-of-line-assembly-processes","title":"Back-End of Line Assembly Processes","description":"\u003cdiv style='-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\u003cdiv style='background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;'\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Description\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eThe semiconductor industry provides critical enabling technology for many products and fields and has seen periods of rapid growth.  While electronic goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eThis course provides an overview of end-of-line packaging assembly. As different packages have different assembly processes, this course touches on key package assembly technologies for wirebond leadframe packages and flip chip on substrate packaging.  Key assembly processes of molding, underfilling, plating, ball attach, and PCB assembly will be shared in this course.  Those interested in end-of-line assembly will learn about these technologies, inclusive of their various processes, materials, and future direction to meet the semiconductor application needs.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e​\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e \u003c\/p\u003e\n\u003cp style=\"background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eLearning Objectives:\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/p\u003e\n\u003c\/div\u003e\u003c\/div\u003e\u003cdiv style=\"-webkit-text-stroke-width:0px;background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:sans-serif;font-size:14px;font-style:normal;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-decoration-thickness:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain the properties of mold compound affecting package reliability.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDescribe the underfill and encapsulant of flip chip technologies.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eIdentify plating parameters related to the plated surface.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eDescribe the formation of the intermetallic effect of ball attachment.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-style:normal;font-weight:normal;margin-top:0px;\"\u003e\u003cem style=\"box-sizing:border-box;\"\u003e\u003ci\u003eExplain the surface mount technologies in PCB assembly.\u003c\/i\u003e\u003c\/em\u003e\u003cbr\u003e \u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eCourse Duration\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e75 minutes\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e \u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eTarget Audience\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eSales engineers\/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, and IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready.\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e \u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003e\u003cstrong style=\"box-sizing:border-box;\"\u003eRequisite Knowledge\u003c\/strong\u003e\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003cp style='background-color:rgba(0, 0, 0, 0);box-sizing:border-box;color:rgb(0, 0, 0);font-family:\"Segoe UI\", \"Segoe UI Web\", Arial, Verdana, sans-serif;font-size:12px;font-style:normal;font-weight:normal;margin-top:0px;'\u003e\u003cem style=\"background-color:rgb(255, 255, 255);box-sizing:border-box;color:rgb(0, 0, 0);font-family:Aptos, Aptos_EmbeddedFont, Aptos_MSFontService, sans-serif;font-size:16px;font-variant-caps:normal;font-variant-ligatures:normal;font-weight:400;letter-spacing:normal;orphans:2;text-align:left;text-decoration-color:initial;text-decoration-style:initial;text-indent:0px;text-transform:none;white-space:normal;widows:2;word-spacing:0px;\"\u003e\u003ci\u003eAt least some college-level scientific knowledge\u003c\/i\u003e\u003c\/em\u003e\u003c\/p\u003e\n\u003c\/div\u003e","brand":"Dr. Lee Teck Kheng","offers":[{"title":"Default Title","offer_id":43106830876739,"sku":"18690","price":19700.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/800x800_Back-EndAssemblyProcess.png?v=1776700843","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/back-end-of-line-assembly-processes","provider":"SEMI Dev 2","version":"1.0","type":"link"}