{"product_id":"3d01900-test-method-for-adhesive-strength-of-adhesive-tray-used-for-thin-chip-handling","title":"3D01900 - SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e1  Purpose\u003cbr\u003e1.1  The purpose of this Standard is to establish the standard for the adhesive strength test method of adhesive tray used for thin chip handling and shipping.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Standard covers measuring system (system configuration, die pick up tool).\u003cbr\u003e2.2  This Standard states test method (die mount layout, measurement environment, peeling speed etc.).\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003cbr\u003eSEMI G97 — Specification for Adhesive Tray Used for Thin Chip Handling\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI 3D19-0619 (Reapproved 1224)\u003cbr\u003eSEMI 3D19-0619 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI 3D19-0619 (Reapproved 1224) - Current","offer_id":43106869346371,"sku":"18174","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D19-0619 - Superseded","offer_id":43106869379139,"sku":"11154","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/3DVolume_ed936a35-cb1d-4cee-8134-399b59c8f491.png?v=1776701995","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/3d01900-test-method-for-adhesive-strength-of-adhesive-tray-used-for-thin-chip-handling","provider":"SEMI Dev 2","version":"1.0","type":"link"}