{"product_id":"3d01600-semi-3d16-specification-for-glass-base-material-for-semiconductor-packaging","title":"3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging","description":"\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThis Specification is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS-IC process or in similar applications. Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV).\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThis Specification describes dimensional and thermal characteristics of glass base material for interposers, RF devices, and other similar packaging substrates.\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThis Specification also applies to openings in glass.\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThe glass substrate is in shape of a wafer (round) or a panel (square or rectangular).\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eIf present, the openings of the glass substrate may be intended to be further processed with metal fillings.\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eThe glass substrate is intended to remain permanently in the package or device.\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cp align=\"justify\"\u003e\u003cfont face=\"arial\" size=\"2\"\u003eMethods of measurements suitable for determining the characteristics in this Specification are indicated.\u003c\/font\u003e\u003c\/p\u003e\u003cp align=\"justify\"\u003e \u003c\/p\u003e\u003cfont face=\"arial\" size=\"2\"\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/font\u003e\u003cp\u003e\u003cfont face=\"arial\" size=\"2\"\u003eSEMI 3D7 — Guide for Alignment Mark for 3DS-IC Process\u003cbr\u003eSEMI 3D11 — Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology\u003cbr\u003eSEMI 3D12 — Guide on Measuring Flatness and Shape of Low Stiffness Substrates\u003cbr\u003eSEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers\u003cbr\u003eSEMI G90 — Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes\u003cbr\u003eSEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers\u003cbr\u003eSEMI M31 — Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers\u003cbr\u003eSEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection\u003cbr\u003eSEMI M40 — Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers\u003cbr\u003eSEMI M45 — Specification for 300 mm Wafer Shipping System\u003cbr\u003eSEMI M59 — Terminology for Silicon Technology\u003cbr\u003eSEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers\u003cbr\u003eSEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning\u003cbr\u003eSEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials\u003cbr\u003eSEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates\u003cbr\u003eSEMI MF1152 — Test Method for Dimensions of Notches on Silicon Wafers\u003cbr\u003eSEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning\u003cbr\u003eSEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning\u003cbr\u003eSEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning\u003cbr\u003eSEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers\u003cbr\u003eSEMI MS1 — Guide to Specifying Wafer-Wafer Bonding Alignment Targets\u003cbr\u003eSEMI T7 — Specification for Back Surface Marking of Double-sided Polished Wafers with a Two-Dimensional Matrix Code Symbol\u003cbr\u003e\u003cbr\u003e\u003cb\u003eRevision History\u003c\/b\u003e\u003cbr\u003eSEMI 3D16-0822 (technical revision)\u003cbr\u003eSEMI 3D16-1116 (first published)\u003c\/font\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI 3D16-0822 - Current","offer_id":40234234970179,"sku":"15220","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D16-1116 - Superseded","offer_id":40234235002947,"sku":"997","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/3DVolume_24795202-a69b-4022-a3b6-c60ce086bef1.png?v=1776703136","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/3d01600-semi-3d16-specification-for-glass-base-material-for-semiconductor-packaging","provider":"SEMI Dev 2","version":"1.0","type":"link"}