{"product_id":"3d01400-semi-3d14-guide-for-incoming-outgoing-quality-control-and-testing-flow-for-3ds-ic-products","title":"3D01400 - SEMI 3D14 - Guide for Incoming\/Outgoing Quality control and Testing Flow for 3DS-IC Products","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003eTo ensure consistent yield control of 3DS-IC products, common criteria for incoming quality control (IQC) and outgoing quality control (OQC) of outsourced subassembly and test (OSAT) are needed. The generic testing flows for different 3DS-IC products defined in this Guide will expedite the progress of 3DS-IC testing.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003eThis Guide will define the criteria for IQC and OQC of OSATs, such as appearance, discoloration, missing ball or crack to clarify the manufacturer’s responsibilities and to improve product yield. This Guide will also define the generic testing flows for different 3DS-IC products, such as chip on chip (CoC), chip on substrate (CoS), chip on wafer (CoW), stacked chip on substrate (SCoS), and wafer on wafer (WoW) to help accelerate the progress of 3DS-IC testing.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e (purchase separately)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003eNone.\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003eSEMI 3D14-0523 (technical revision)\u003c\/span\u003e\u003c\/p\u003e\u003cp\u003e\u003cspan style='font-family:\"Arial\",sans-serif;font-size:10.0pt;'\u003eSEMI 3D14-0615 (first published)\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI 3D14-0523 - Current","offer_id":43106911551555,"sku":"16524","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D14-0615 - Superseded","offer_id":43106911584323,"sku":"995","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/3DVolume_63bfb016-26b2-4a87-94b1-c2533bb2ebbb.png?v=1776703138","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/3d01400-semi-3d14-guide-for-incoming-outgoing-quality-control-and-testing-flow-for-3ds-ic-products","provider":"SEMI Dev 2","version":"1.0","type":"link"}