{"product_id":"3d01000-semi-3d10-guide-to-describing-materials-properties-for-intermediate-wafers-for-use-in-a-300-mm-3ds-ic-wafer-stack-1","title":"3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack","description":"\u003cp class=\"StdsText0\"\u003e \u003c\/p\u003e\u003cp\u003e1  Purpose\u003cbr\u003e1.1  This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process.\u003cbr\u003e2  Scope\u003cbr\u003e2.1  This Guide provides the tools to describe individual wafers in a 3DS-IC process. In particular, this Document provides direction for describing the dimensions, materials, and devices for wafers that have undergone processing and are entering 3D stacking process steps. Since a 3D stacking process may include wafers from multiple fabrication facilities, it is important that this information is available to ensure additional process steps are performed correctly.\u003cbr\u003e2.2  This Guide describes wafers and wafer stacks with nominal diameter of 300 mm and nominal thickness of 775 µm, although the actual wafer diameter and\/or thickness may differ due to 3D stacking requirements and\/or the effects of prior processing steps.\u003cbr\u003e\u003cstrong\u003eNOTICE: \u003c\/strong\u003eSEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards \u003c\/strong\u003e(purchase separately)\u003cbr\u003eSEMI M1 — Specification for Polished Single Crystal Silicon Wafers\u003cbr\u003eSEMI M45 — Specification for 300 mm Wafer Shipping System\u003cbr\u003eSEMI M59 — Terminology for Silicon Technology\u003cbr\u003eSEMI MF534 — Test Method for Bow of Silicon Wafers\u003cbr\u003eSEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning\u003cbr\u003eSEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning\u003cbr\u003eSEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning\u003cbr\u003eSEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eRevision History\u003c\/strong\u003e\u003cbr\u003eSEMI 3D10-0814 (Reapproved 1025)\u003cbr\u003eSEMI 3D10-0814 (Reapproved 0420)\u003cbr\u003eSEMI 3D10-0814 (first published)\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI 3D10-0814 (Reapproved 1025) - Current","offer_id":43106911944771,"sku":"18795","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D10-0814 (Reapproved 0420) - Superseded","offer_id":43106911977539,"sku":"13815","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D10-0814 - Superseded","offer_id":40234243031107,"sku":"991","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/3DVolume_3b8e671e-4cf5-4ac4-9c1d-f41c65abb234.png?v=1776703147","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/3d01000-semi-3d10-guide-to-describing-materials-properties-for-intermediate-wafers-for-use-in-a-300-mm-3ds-ic-wafer-stack-1","provider":"SEMI Dev 2","version":"1.0","type":"link"}