{"product_id":"3d00200-semi-3d2-specification-for-glass-carrier-wafers-for-3ds-ic-applications","title":"3D00200 - SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications","description":"\u003cp align=\"justify\"\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003cp align=\"justify\"\u003e \u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e\u003cb\u003eNOTICE:\u003c\/b\u003e This Document was reapproved with minor editorial changes.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eThis Specification is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure glass carrier wafers to be used in a 3DS-IC process.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eThis Specification describes dimensional, thermal, and wafer preparation characteristics for glass starting material that will be used as carrier wafers in a temporary bonded state.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eThis Specification describes glass carrier wafers with nominal diameters of 200 mm and 300 mm, and a thickness of 700 µm, although the wafer diameter and thickness required may vary due to process and functional variation. \u003ca name=\"_Toc215911941\"\u003e\u003c\/a\u003e\u003ca name=\"_Toc239666318\"\u003e\u003cspan style=\"mso-bookmark: _Toc215911941;\"\u003eSuch variations shall be clarified in the purchasing order or in the contract.\u003c\/span\u003e\u003c\/a\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"mso-bookmark: _Toc239666318;\"\u003e\u003cspan style=\"mso-bookmark: _Toc215911941;\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"mso-bookmark: _Toc239666318;\"\u003e\u003cspan style=\"mso-bookmark: _Toc215911941;\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eMethods of measurements suitable for determining the characteristics in the specifications are indicated.\u003c\/span\u003e\u003c\/span\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e\u003cb\u003eReferenced SEMI Standards\u003c\/b\u003e (purchase separately)\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI 3D12 — Guide for Measuring Flatness and Shape of Low Stiffness Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI G90 — Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI M12 — Specification for Serial Alphanumeric Marking of the Front Surface of Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI M31 — Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI M35 — Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI M40 — Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI M45 — Specification for 300 mm Wafer Shipping System\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI M59 — Terminology for Silicon Technology\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF533 — Test Method for Thickness and Thickness Variation of Silicon Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF657 — Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 0914)\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF671 — Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF928 — Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF1152 — Test Method for Dimensions of Notches on Silicon Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF1390 — Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF1530 — Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF1617 — Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI MF2074 — Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e \u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003e\u003cb\u003eRevision History\u003c\/b\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI 3D2-0216 (Reapproved 0222)\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI 3D2-0216 (technical revision)\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI 3D2-1113 (technical revision)\u003c\/span\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size: 10.0pt; line-height: 107%; font-family: 'Arial',sans-serif;\"\u003eSEMI 3D2-0113 (first published)\u003c\/span\u003e\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI 3D2-0216 (Reapproved 0222) - Current","offer_id":40234234380355,"sku":"14906","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D2-0216 - Superseded","offer_id":40234234413123,"sku":"1000","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D2-1113 - Superseded","offer_id":40234234445891,"sku":"1297","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D2-0113 - Superseded","offer_id":40234234478659,"sku":"1097","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/3DVolume_944f6b44-89cc-453b-99bd-55989aa5d2b8.png?v=1776703147","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/3d00200-semi-3d2-specification-for-glass-carrier-wafers-for-3ds-ic-applications","provider":"SEMI Dev 2","version":"1.0","type":"link"}