{"product_id":"3d00100-semi-3d1-terminology-for-through-silicon-via-geometrical-metrology-1","title":"3D00100 - SEMI 3D1 - Terminology for Through Silicon via Geometrical Metrology","description":"\u003cp\u003e \u003c\/p\u003e\u003cp\u003eClear and commonly accepted definitions are needed for efficient communication and to prevent misunderstanding between buyers and vendors of metrology equipment and manufacturing services. The purpose of this Document is to provide a consistent terminology for the understanding and discussion of metrology issues important to through silicon vias (TSV).\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThe scope of this Document is limited to the definitions of terms used to specify measured quantities that characterize TSV. This Document does not describe measurement procedures, but rather attempts to define the measurands clearly, usefully, and unambiguously.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThe focus of this Document is on geometry-related metrology and measurands important for definition and control of fabrication and inspection operations on structures that include openings for TSV.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Document is intended for TSVs in silicon.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Document does not attempt to discuss statistical considerations, which are covered in SEMI E89 and elsewhere.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003eThis Document adapts structure and wording from other SEMI Documents, particularly SEMI P35.\u003c\/p\u003e\u003cp\u003e \u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eReferenced SEMI Standards\u003c\/strong\u003e\u003c\/p\u003e\u003cp\u003eSEMI E89 — Guide for Measurement System Analysis (MSA)\u003cbr\u003eSEMI P35 — Terminology for Microlithography Metrology\u003c\/p\u003e","brand":"semi.org","offers":[{"title":"SEMI 3D1-0519 - Inactive","offer_id":43106912010307,"sku":"8817","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D1-0912 (Reapproved 0418) - Superseded","offer_id":40234237624387,"sku":"990","price":31900.0,"currency_code":"JPY","in_stock":true},{"title":"SEMI 3D1-0912 - Superseded","offer_id":40234237788227,"sku":"1096","price":31900.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0567\/3402\/3747\/files\/3DVolume.png?v=1776703149","url":"https:\/\/store-dev2.semi.org\/en-jp\/products\/3d00100-semi-3d1-terminology-for-through-silicon-via-geometrical-metrology-1","provider":"SEMI Dev 2","version":"1.0","type":"link"}