SEMI Standards

SEMI Standards are voluntary technical agreements for the semiconductor, flat panel display, micro-electromechanical systems, photovoltaic, and high-brightness LED industries.

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1625 products

M05400 - SEMI M54 - Guide for Semi-Insulating (SI) GaAs Material Parameters
SEMI M54 - Guide for Semi-Insulating (SI) GaAs Material Parameters Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF008400 - SEMI MF84 - Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe
SEMI MF84 - Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F07800 - SEMI F78 - Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications
SEMI F78 - Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
M06800 - SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD
SEMI M68 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Height Data Array Using a Curvature Metric, ZDD Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F05100 - SEMI F51 - Guide for Elastometric Sealing Technology
SEMI F51 - Guide for Elastometric Sealing Technology Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F04400 - SEMI F44 - Specification for Machined Stainless Steel Weld Fittings
SEMI F44 - Specification for Machined Stainless Steel Weld Fittings Sale price Member Price : ¥113
M08800 - SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods
SEMI M88 - Practice for Sample Preparation Methods for Measuring Minority Carrier Diffusion Length in Silicon Wafers by Surface Photovoltage Methods Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F02300 - SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen
SEMI F23 - Specification for Particle Concentration of Grade 10/0.2 Hydrogen Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F04500 - SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings
SEMI F45 - Specification for Machined Stainless Steel Reducing Weld Fittings Sale price Member Price : ¥113
MF002800 - SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF180900 - SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M04000 - SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05500 - SEMI G55 - Test Method for Measurement of Silver Plating Brightness
SEMI G55 - Test Method for Measurement of Silver Plating Brightness Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M05000 - SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
HB00100 - SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices
SEMI HB1 - Specification for Sapphire Wafers Intended for Use for Manufacturing High Brightness-Light Emitting Diode Devices Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G06300 - SEMI G63 - ダイ剪断強度の測定方法
SEMI G63 - ダイ剪断強度の測定方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
HB00500 - SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB5 - Test Method for Measurement of Saw Marks on Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M05600 - SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF213900 - SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
SEMI MF2139 - Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer
SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
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