SEMI Standards

SEMI Standards are voluntary technical agreements for the semiconductor, flat panel display, micro-electromechanical systems, photovoltaic, and high-brightness LED industries.

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1625 products

C00603 - SEMI C6.3 - パイプラインガスとして授受されるグレード20/0.2水素（H2）に対するパーティクル仕様
SEMI C6.3 - パイプラインガスとして授受されるグレード20/0.2水素（H2）に対するパーティクル仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages
SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G00800 - SEMI G8 - 金めっきの試験方法
SEMI G8 - 金めっきの試験方法 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G03000 - SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法
SEMI G30 - セラミックパッケージのジャンクションとケース間の熱抵抗測定のための試験方法 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G03200 - SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン
SEMI G32 - カプセルなし熱抵抗測定用チップのガイドライン Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages Regular price¥49,500 JPY Sale price¥31,900 JPY
G09100 - SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog
SEMI G91 - Standard Test Data Format (STDF) Memory Fail Datalog Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05800 - SEMI G58 - CERQUADパッケージ構造の仕様
SEMI G58 - CERQUADパッケージ構造の仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G07200 - SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様
SEMI G72 - ボールグリッドアレイ設計ライブラリのための仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G03400 - SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
SEMI G34 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G00600 - SEMI G6 - Test Method for Seal Ring Flatness
SEMI G6 - Test Method for Seal Ring Flatness Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages
SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G00300 - SEMI G3 - Specification for Sidebrazed Laminates
SEMI G3 - Specification for Sidebrazed Laminates Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly
SEMI G53 - Specification for Metal Lid/Preform Assembly Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G03900 - SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
SEMI G39 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G06100 - SEMI G61 - Specification for Cofired Ceramic Packages
SEMI G61 - Specification for Cofired Ceramic Packages Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G00300 - SEMI G3 - 仕様　側面ろう付け積層板
SEMI G3 - 仕様　側面ろう付け積層板 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
T01200 - SEMI T12 - Specification for Tracing Jigs and Implements
SEMI T12 - Specification for Tracing Jigs and Implements Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling
SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
G00900 - SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム
SEMI G9 - 仕様　スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム Sale priceMember Price: ¥135
Non-Member Price: ¥29,700
G04700 - SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes
SEMI G47 - Specification for Plastic Molded Quad Flat Pack Leadframes Sale priceMember Price: ¥113
Non-Member Price: ¥24,800
T01400 - SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers
SEMI T14 - Specification for Micro ID on 300 mm Silicon Wafers Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
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