SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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1910 products

D01000 - SEMI D10 - FPD用ガラス基板の耐薬品性テスト方法
SEMI D10 - FPD用ガラス基板の耐薬品性テスト方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
C00322 - SEMI C3.22 - Standard for Oxygen (O2), 99.5% Quality
SEMI C3.22 - Standard for Oxygen (O2), 99.5% Quality Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
D04000 - SEMI D40 - Terminology for FPD Substrate Deflection
SEMI D40 - Terminology for FPD Substrate Deflection Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
C09500 - SEMI C95 - Guide for Pentakis Dimethylamino Tantalum
SEMI C95 - Guide for Pentakis Dimethylamino Tantalum Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
C00341 - SEMI C3.41 - Standard for Oxygen (O2), Bulk, 99.9998% Quality
SEMI C3.41 - Standard for Oxygen (O2), Bulk, 99.9998% Quality Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
C05400 - SEMI C54 - Specification for Oxygen (O2)
SEMI C54 - Specification for Oxygen (O2) Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
C09000 - SEMI C90 - Specification for Perfluoroalkoxy Alkane (PFA) and Other Fluorinated Materials Used In Liquid Chemical Distribution Systems
SEMI C90 - Specification for Perfluoroalkoxy Alkane (PFA) and Other Fluorinated Materials Used In Liquid Chemical Distribution Systems Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
3D01800 - SEMI 3D18 - Guide for Wafer Edge Trimming for 3DS-IC Process
SEMI 3D18 - Guide for Wafer Edge Trimming for 3DS-IC Process Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
D03000 - SEMI D30 - Test Method for Light Resistance in Flat Panel Display (FPD) Color Filters
SEMI D30 - Test Method for Light Resistance in Flat Panel Display (FPD) Color Filters Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
C06700 - SEMI C67 - Guide for Hafnium Amides
SEMI C67 - Guide for Hafnium Amides Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
3D00200 - SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications
SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
D05100 - SEMI D51 - Specification for Handshake Method of Single Substrate for Handling Off/On Tool in FPD Production
SEMI D51 - Specification for Handshake Method of Single Substrate for Handling Off/On Tool in FPD Production Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
C07800 - SEMI C78 - Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Atomic Force Microscopy
SEMI C78 - Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Atomic Force Microscopy Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
D03600 - SEMI D36 - Terminology for LCD Backlight Unit
SEMI D36 - Terminology for LCD Backlight Unit Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
D04600 - SEMI D46 - FPD偏光板の用語
SEMI D46 - FPD偏光板の用語 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100