SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

MF002800 - SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
SEMI MF28 - Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G01000 - SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法
SEMI G10 - プラスチックパッケージリードフレームの機械的標準測定方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
M05000 - SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
SEMI M50 - Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G03100 - SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
SEMI G31 - Test Method for Determining the Abrasive Characteristics of Molding Compounds Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E01000 - SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
SEMI E10 - Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
E03700 - SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services
SEMI E37 - Specification for High-Speed SECS Message Services (HSMS) Generic Services Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
E04000 - SEMI E40 - Specification for Processing Management
SEMI E40 - Specification for Processing Management Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E00400 - SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
SEMI E4 - Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling
SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E03900 - SEMI E39 - Specification for Object Services: Concepts, Behavior, and Services
SEMI E39 - Specification for Object Services: Concepts, Behavior, and Services Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F10500 - SEMI F105 - Guide for Metallic Material Compatibility in Gas Distribution Systems
SEMI F105 - Guide for Metallic Material Compatibility in Gas Distribution Systems Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
MF136600 - SEMI MF1366 - Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry
SEMI MF1366 - Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness
SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E00500 - SEMI E5 - 半導体製造装置通信スタンダード2 メッセージ内容（SECS-II）
SEMI E5 - 半導体製造装置通信スタンダード2 メッセージ内容（SECS-II） Sale priceMember Price: ¥135
Non-Member Price: ¥75,400
E13200 - SEMI E132 - Specification for Equipment Client Authentication and Authorization
SEMI E132 - Specification for Equipment Client Authentication and Authorization Sale price Member Price : ¥113
E11600 - SEMI E116 - Specification for Equipment Performance Tracking
SEMI E116 - Specification for Equipment Performance Tracking Sale priceMember Price: ¥225
Non-Member Price: ¥62,700
E09000 - SEMI E90 - Specification for Substrate Tracking
SEMI E90 - Specification for Substrate Tracking Sale price Member Price : ¥113
World Fab Forecast - Subscription
World Fab Forecast Subscription Sale priceMember Price: ¥6,300
Non-Member Price: ¥1,829,400
MF115300 - SEMI MF1153 - Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements
SEMI MF1153 - Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G02000 - SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
SEMI G20 - Specification for Lead Finishes for Plastic Packages (Active Devices Only) Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E15300 - SEMI E153 - Specification for AMHS SEM (AMHS SEM)
SEMI E153 - Specification for AMHS SEM (AMHS SEM) Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F03800 - SEMI F38 - Test Method for Efficiency Qualification of Point-of-Use Gas Filters
SEMI F38 - Test Method for Efficiency Qualification of Point-of-Use Gas Filters Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
E15700 - SEMI E157 - Specification for Module and Substrate Process TrackingE15700 - SEMI E157 - Specification for Module and Substrate Process Tracking
SEMI E157 - Specification for Module and Substrate Process Tracking Sale price Member Price : ¥113