SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging

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1910 products

HB00700 - SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes
SEMI HB7 - Test Method for Measurement of Waviness of Crystalline Sapphire Wafers by Using Optical Probes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M05600 - SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
SEMI M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology
SEMI G57 - Guide for Standardization of Leadframe Terminology Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
SEMI G73 - Test Method for Pull Strength for Wire Bonding Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F02200 - SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems
SEMI F22 - Guide for Bulk and Specialty Gas Distribution Systems Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape
SEMI G75 - Standard Test Method of the Properties of Leadframe Tape Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer
SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G05200 - SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
SEMI G52 - Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
HB00300 - SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port
SEMI HB3 - Specification for the Mechanical Interface for 150 mm HB-LED Load Port Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M07000 - SEMI M70 - パーシャルサイト平坦度を使ってウェーハのエッジ近傍形状を決定するための作業方法
SEMI M70 - パーシャルサイト平坦度を使ってウェーハのエッジ近傍形状を決定するための作業方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices
SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
F02600 - SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases
SEMI F26 - Specification for Particle Concentration of Grade 10/0.2 Toxic Specialty Gases Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M04400 - SEMI M44 - Guide to Conversion Factors for Interstitial Oxygen in Silicon
SEMI M44 - Guide to Conversion Factors for Interstitial Oxygen in Silicon Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
G07300 - SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法
SEMI G73 - ワイヤボンディングに関するプル強度のための試験方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法
SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G07000 - SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード
SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G01100 - SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法
SEMI G11 - 熱硬化性モールディングコンパウンドのラムフォロワー装置によるゲル化時間およびスパイラルフローの推奨作業方法 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
M01600 - SEMI M16 - Specification for Polycrystalline Silicon
SEMI M16 - Specification for Polycrystalline Silicon Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M06300 - SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様
SEMI M63 - 化合物半導体エピタキシャルウェーハに使用するサファイア基板の仕様 Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G05200 - SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案）
SEMI G52 - 半導体リードフレームのイオン汚染物の測定のための標準測定法（提案） Sale priceMember Price: ¥135
Non-Member Price: ¥38,100
G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer
SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Sale priceMember Price: ¥113
Non-Member Price: ¥31,900
M08200 - SEMI M82 - Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy
SEMI M82 - Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy Sale priceMember Price: ¥113
Non-Member Price: ¥31,900