SEMI 3D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

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SEMIViews - ReaderSEMIViews - Reader
SEMIViews Reader Sale priceMember Price: $875.00
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C06600 - SEMI C66 - Guide for Trimethylaluminium (TMAI), 99.5% Quality
SEMI C66 - Guide for Trimethylaluminium (TMAI), 99.5% Quality Sale priceMember Price: $113.00
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D02100 - SEMI D21 - Terminology for FPD Mask Pattern Accuracy
SEMI D21 - Terminology for FPD Mask Pattern Accuracy Sale priceMember Price: $113.00
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C05000 - SEMI C50 - Guide for Trimethylphosphite
SEMI C50 - Guide for Trimethylphosphite Sale priceMember Price: $113.00
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D02500 - SEMI D25 - FPDガラス基板輸送用梱包ケースの仕様
SEMI D25 - FPDガラス基板輸送用梱包ケースの仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
C08300 - SEMI C83 - PFA融着継手で作られる融着接合部に加える引っ張り強度のための試験方法
SEMI C83 - PFA融着継手で作られる融着接合部に加える引っ張り強度のための試験方法 Sale priceMember Price: $135.00
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D04900 - SEMI D49 - Specification of Single Substrate Orientation for Loading/Unloading Into/From Equipment to Specify ID Reader Position
SEMI D49 - Specification of Single Substrate Orientation for Loading/Unloading Into/From Equipment to Specify ID Reader Position Sale priceMember Price: $113.00
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C08900 - SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS)
SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS) Sale priceMember Price: $113.00
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D02200 - SEMI D22 - Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies
SEMI D22 - Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies Sale priceMember Price: $113.00
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C00306 - SEMI C3.6 - シリンダ中のホスフィン（PH3），品質99.98% の仕様
SEMI C3.6 - シリンダ中のホスフィン（PH3），品質99.98% の仕様 Sale priceMember Price: $135.00
Non-Member Price: $231.00
3D00600 - SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration
SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration Sale priceMember Price: $113.00
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C00352 - SEMI C3.52 - Standard for Tungsten Hexafluoride, 99.996% Quality
SEMI C3.52 - Standard for Tungsten Hexafluoride, 99.996% Quality Sale priceMember Price: $113.00
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C00328 - SEMI C3.28 - Standard for Nitrogen (N2), VLSI Grade in Cylinders, 99.9996% Quality
SEMI C3.28 - Standard for Nitrogen (N2), VLSI Grade in Cylinders, 99.9996% Quality Sale priceMember Price: $113.00
Non-Member Price: $193.00
D01200 - SEMI D12 - FPD基板のエッジ状態の仕様
SEMI D12 - FPD基板のエッジ状態の仕様 Sale priceMember Price: $135.00
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C00356 - SEMI C3.56 - Specification for Diborane Mixtures
SEMI C3.56 - Specification for Diborane Mixtures Sale priceMember Price: $113.00
Non-Member Price: $193.00